Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    124-83-422-41-002101

    124-83-422-41-002101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,466
    RFQ

    -

    124-83-422-41-002101 124 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-6511-10

    28-6511-10

    CONN IC DIP SOCKET 28POS TIN

    Aries Electronics

    3,698
    RFQ
    28-6511-10

    Datasheet

    28-6511-10 511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-6501-20

    08-6501-20

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    3,092
    RFQ
    08-6501-20

    Datasheet

    08-6501-20 501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-6501-30

    08-6501-30

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    2,367
    RFQ
    08-6501-30

    Datasheet

    08-6501-30 501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    299-87-318-11-001101

    299-87-318-11-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    3,557
    RFQ
    299-87-318-11-001101

    Datasheet

    299-87-318-11-001101 299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-642-41-134161

    114-83-642-41-134161

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    2,683
    RFQ
    114-83-642-41-134161

    Datasheet

    114-83-642-41-134161 114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    214-44-316-01-670799

    214-44-316-01-670799

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    3,745
    RFQ

    -

    214-44-316-01-670799 214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    214-99-316-01-670799

    214-99-316-01-670799

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    2,679
    RFQ

    -

    214-99-316-01-670799 214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    22-6511-10

    22-6511-10

    CONN IC DIP SOCKET 22POS TIN

    Aries Electronics

    3,156
    RFQ
    22-6511-10

    Datasheet

    22-6511-10 511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-0518-11

    32-0518-11

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    2,744
    RFQ
    32-0518-11

    Datasheet

    32-0518-11 518 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-820-90T

    08-820-90T

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    2,250
    RFQ
    08-820-90T

    Datasheet

    08-820-90T Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    1571541-4

    1571541-4

    CONN SOCKET PLCC 84POS TIN

    TE Connectivity AMP Connectors

    4,018
    RFQ
    1571541-4

    Datasheet

    1571541-4 PCS Bulk Obsolete PLCC 84 (4 x 21) 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Polyphenylene Sulfide (PPS) -
    146-87-632-41-035101

    146-87-632-41-035101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,344
    RFQ
    146-87-632-41-035101

    Datasheet

    146-87-632-41-035101 146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-628-STT-L

    ICO-628-STT-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,661
    RFQ
    ICO-628-STT-L

    Datasheet

    ICO-628-STT-L ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    32-3513-10T

    32-3513-10T

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,276
    RFQ
    32-3513-10T

    Datasheet

    32-3513-10T Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICO-318-SST

    ICO-318-SST

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,396
    RFQ
    ICO-318-SST

    Datasheet

    ICO-318-SST ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    840-AG11D-ES

    840-AG11D-ES

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    2,154
    RFQ
    840-AG11D-ES

    Datasheet

    840-AG11D-ES 800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    614-83-640-41-001101

    614-83-640-41-001101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    4,578
    RFQ
    614-83-640-41-001101

    Datasheet

    614-83-640-41-001101 614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    29-0518-10H

    29-0518-10H

    CONN SOCKET SIP 29POS GOLD

    Aries Electronics

    2,432
    RFQ
    29-0518-10H

    Datasheet

    29-0518-10H 518 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-324-41-004101

    116-87-324-41-004101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,422
    RFQ
    116-87-324-41-004101

    Datasheet

    116-87-324-41-004101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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