Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    510-83-066-11-002101

    510-83-066-11-002101

    CONN SOCKET PGA 66POS GOLD

    Preci-Dip

    3,101
    RFQ
    510-83-066-11-002101

    Datasheet

    510-83-066-11-002101 510 Bulk Active PGA 66 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-83-328-41-001101

    123-83-328-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,062
    RFQ
    123-83-328-41-001101

    Datasheet

    123-83-328-41-001101 123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    2-1571586-5

    2-1571586-5

    CONN IC DIP SOCKET 18POS GOLD

    TE Connectivity AMP Connectors

    4,003
    RFQ
    2-1571586-5

    Datasheet

    2-1571586-5 800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    28-6518-11

    28-6518-11

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,832
    RFQ
    28-6518-11

    Datasheet

    28-6518-11 518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    AR32-HZW/T-R

    AR32-HZW/T-R

    CONN IC DIP SOCKET 32POS TIN

    Assmann WSW Components

    3,151
    RFQ
    AR32-HZW/T-R

    Datasheet

    AR32-HZW/T-R - Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    14-3501-20

    14-3501-20

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    2,258
    RFQ
    14-3501-20

    Datasheet

    14-3501-20 501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3501-30

    14-3501-30

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    2,837
    RFQ
    14-3501-30

    Datasheet

    14-3501-30 501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    02-7250-10

    02-7250-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    2,411
    RFQ
    02-7250-10

    Datasheet

    02-7250-10 700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7350-10

    02-7350-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    4,543
    RFQ
    02-7350-10

    Datasheet

    02-7350-10 700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7400-10

    02-7400-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    4,484
    RFQ
    02-7400-10

    Datasheet

    02-7400-10 700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7420-10

    02-7420-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    3,791
    RFQ
    02-7420-10

    Datasheet

    02-7420-10 700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7425-10

    02-7425-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    3,505
    RFQ
    02-7425-10

    Datasheet

    02-7425-10 700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7450-10

    02-7450-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    4,149
    RFQ
    02-7450-10

    Datasheet

    02-7450-10 700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7520-10

    02-7520-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    2,233
    RFQ
    02-7520-10

    Datasheet

    02-7520-10 700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7540-10

    02-7540-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    2,717
    RFQ
    02-7540-10

    Datasheet

    02-7540-10 700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7625-10

    02-7625-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    4,883
    RFQ
    02-7625-10

    Datasheet

    02-7625-10 700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7920-10

    02-7920-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    2,267
    RFQ
    02-7920-10

    Datasheet

    02-7920-10 700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-83-636-41-018101

    116-83-636-41-018101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    3,682
    RFQ
    116-83-636-41-018101

    Datasheet

    116-83-636-41-018101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    32-0518-10T

    32-0518-10T

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    3,609
    RFQ
    32-0518-10T

    Datasheet

    32-0518-10T 518 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-328-41-008101

    116-83-328-41-008101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,003
    RFQ
    116-83-328-41-008101

    Datasheet

    116-83-328-41-008101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 246247248249250251252253...955Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER