Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    346-43-112-41-013000

    346-43-112-41-013000

    CONN SOCKET SIP 12POS GOLD

    Mill-Max Manufacturing Corp.

    4,825
    RFQ
    346-43-112-41-013000

    Datasheet

    346-43-112-41-013000 346 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    212-1-28-006

    212-1-28-006

    CONN IC DIP SOCKET 28POS GOLD

    CNC Tech

    4,176
    RFQ
    212-1-28-006

    Datasheet

    212-1-28-006 - Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
    HLS-0112-S-22

    HLS-0112-S-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,404
    RFQ
    HLS-0112-S-22

    Datasheet

    HLS-0112-S-22 HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    34-3513-10T

    34-3513-10T

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    4,491
    RFQ
    34-3513-10T

    Datasheet

    34-3513-10T Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    614-83-636-31-012101

    614-83-636-31-012101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    4,244
    RFQ
    614-83-636-31-012101

    Datasheet

    614-83-636-31-012101 614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    03-0511-10

    03-0511-10

    CONN SOCKET SIP 3POS TIN

    Aries Electronics

    2,749
    RFQ
    03-0511-10

    Datasheet

    03-0511-10 511 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-6513-10

    30-6513-10

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,010
    RFQ
    30-6513-10

    Datasheet

    30-6513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-820-90C

    06-820-90C

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    2,800
    RFQ
    06-820-90C

    Datasheet

    06-820-90C Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-822-90C

    06-822-90C

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    2,971
    RFQ
    06-822-90C

    Datasheet

    06-822-90C Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-823-90C

    06-823-90C

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    4,456
    RFQ
    06-823-90C

    Datasheet

    06-823-90C Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    122-83-428-41-001101

    122-83-428-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,370
    RFQ
    122-83-428-41-001101

    Datasheet

    122-83-428-41-001101 122 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-422-41-004101

    116-87-422-41-004101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,479
    RFQ
    116-87-422-41-004101

    Datasheet

    116-87-422-41-004101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-316-WTT-3

    ICA-316-WTT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,285
    RFQ
    ICA-316-WTT-3

    Datasheet

    ICA-316-WTT-3 ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    1-1437540-0

    1-1437540-0

    CONN IC DIP SOCKET 36POS GOLD

    TE Connectivity AMP Connectors

    3,988
    RFQ
    1-1437540-0

    Datasheet

    1-1437540-0 800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    ICA-308-WGT-2

    ICA-308-WGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,089
    RFQ
    ICA-308-WGT-2

    Datasheet

    ICA-308-WGT-2 ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    115-83-650-41-001101

    115-83-650-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    2,475
    RFQ

    -

    115-83-650-41-001101 115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0206-T-10

    HLS-0206-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,108
    RFQ
    HLS-0206-T-10

    Datasheet

    HLS-0206-T-10 HLS Tube Active SIP 12 (2 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-87-632-41-002101

    116-87-632-41-002101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,119
    RFQ
    116-87-632-41-002101

    Datasheet

    116-87-632-41-002101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    30-6511-10

    30-6511-10

    CONN IC DIP SOCKET 30POS TIN

    Aries Electronics

    2,268
    RFQ
    30-6511-10

    Datasheet

    30-6511-10 511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7400-11

    02-7400-11

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    2,981
    RFQ
    02-7400-11

    Datasheet

    02-7400-11 700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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