Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    510-83-069-11-061101

    510-83-069-11-061101

    CONN SOCKET PGA 69POS GOLD

    Preci-Dip

    3,819
    RFQ
    510-83-069-11-061101

    Datasheet

    510-83-069-11-061101 510 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    34-1518-10H

    34-1518-10H

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    3,417
    RFQ
    34-1518-10H

    Datasheet

    34-1518-10H 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    06-3518-10E

    06-3518-10E

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    3,625
    RFQ
    06-3518-10E

    Datasheet

    06-3518-10E 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    APO-310-T-R

    APO-310-T-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,876
    RFQ
    APO-310-T-R

    Datasheet

    APO-310-T-R APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-83-640-41-003101

    116-83-640-41-003101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    4,503
    RFQ
    116-83-640-41-003101

    Datasheet

    116-83-640-41-003101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-316-ZSGT

    ICA-316-ZSGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,890
    RFQ
    ICA-316-ZSGT

    Datasheet

    ICA-316-ZSGT ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-316-ZSGT

    ICO-316-ZSGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,937
    RFQ
    ICO-316-ZSGT

    Datasheet

    ICO-316-ZSGT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-83-432-41-008101

    116-83-432-41-008101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,018
    RFQ
    116-83-432-41-008101

    Datasheet

    116-83-432-41-008101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-648-41-012101

    116-87-648-41-012101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    2,276
    RFQ
    116-87-648-41-012101

    Datasheet

    116-87-648-41-012101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    24-6518-10M

    24-6518-10M

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,327
    RFQ
    24-6518-10M

    Datasheet

    24-6518-10M 518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-87-952-41-001101

    614-87-952-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    4,808
    RFQ
    614-87-952-41-001101

    Datasheet

    614-87-952-41-001101 614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-642-41-018101

    116-83-642-41-018101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    3,061
    RFQ
    116-83-642-41-018101

    Datasheet

    116-83-642-41-018101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-432-41-011101

    116-87-432-41-011101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,877
    RFQ
    116-87-432-41-011101

    Datasheet

    116-87-432-41-011101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-1518-11

    28-1518-11

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,204
    RFQ
    28-1518-11

    Datasheet

    28-1518-11 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    146-87-642-41-036101

    146-87-642-41-036101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    4,387
    RFQ
    146-87-642-41-036101

    Datasheet

    146-87-642-41-036101 146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-640-T-O-TR

    ICF-640-T-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,327
    RFQ
    ICF-640-T-O-TR

    Datasheet

    ICF-640-T-O-TR ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    HLS-0113-T-10

    HLS-0113-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,472
    RFQ
    HLS-0113-T-10

    Datasheet

    HLS-0113-T-10 HLS Tube Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-87-624-41-004101

    116-87-624-41-004101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,378
    RFQ
    116-87-624-41-004101

    Datasheet

    116-87-624-41-004101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1-1437538-6

    1-1437538-6

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    2,472
    RFQ
    1-1437538-6

    Datasheet

    1-1437538-6 800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    116-83-636-41-003101

    116-83-636-41-003101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    3,228
    RFQ
    116-83-636-41-003101

    Datasheet

    116-83-636-41-003101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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