Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    12-1508-30

    12-1508-30

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,762
    RFQ
    12-1508-30

    Datasheet

    12-1508-30 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    ICF-318-S-O-TR

    ICF-318-S-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,965
    RFQ
    ICF-318-S-O-TR

    Datasheet

    ICF-318-S-O-TR ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-318-SM-O-TR

    ICF-318-SM-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,539
    RFQ
    ICF-318-SM-O-TR

    Datasheet

    ICF-318-SM-O-TR ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-318-S-I-TR

    ICF-318-S-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,796
    RFQ
    ICF-318-S-I-TR

    Datasheet

    ICF-318-S-I-TR ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    28-0518-11

    28-0518-11

    CONN SOCKET SIP 28POS GOLD

    Aries Electronics

    2,367
    RFQ
    28-0518-11

    Datasheet

    28-0518-11 518 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-87-950-31-012101

    614-87-950-31-012101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    4,445
    RFQ
    614-87-950-31-012101

    Datasheet

    614-87-950-31-012101 614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-314-ZMGT

    ICO-314-ZMGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,128
    RFQ
    ICO-314-ZMGT

    Datasheet

    ICO-314-ZMGT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-422-WTT-2

    ICA-422-WTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,303
    RFQ
    ICA-422-WTT-2

    Datasheet

    ICA-422-WTT-2 ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICA-322-WTT-2

    ICA-322-WTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,128
    RFQ
    ICA-322-WTT-2

    Datasheet

    ICA-322-WTT-2 ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    116-83-428-41-009101

    116-83-428-41-009101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,732
    RFQ
    116-83-428-41-009101

    Datasheet

    116-83-428-41-009101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    PGA132H012B1-1414R

    PGA132H012B1-1414R

    PGA SOCKET 132 CTS

    Amphenol ICC (FCI)

    4,279
    RFQ
    PGA132H012B1-1414R

    Datasheet

    PGA132H012B1-1414R - - Active PGA 132 (14 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Through Hole Open Frame - - - - - - -
    ICA-328-SGT

    ICA-328-SGT

    CONN IC DIP SOCKET 28POS GOLD

    Samtec Inc.

    2,198
    RFQ
    ICA-328-SGT

    Datasheet

    ICA-328-SGT ICA Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    614-83-642-31-012101

    614-83-642-31-012101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    2,151
    RFQ
    614-83-642-31-012101

    Datasheet

    614-83-642-31-012101 614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0207-T-10

    HLS-0207-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,161
    RFQ
    HLS-0207-T-10

    Datasheet

    HLS-0207-T-10 HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    ICF-320-S-I-TR

    ICF-320-S-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,350
    RFQ
    ICF-320-S-I-TR

    Datasheet

    ICF-320-S-I-TR ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    116-83-628-41-001101

    116-83-628-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,269
    RFQ
    116-83-628-41-001101

    Datasheet

    116-83-628-41-001101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    10-6513-11H

    10-6513-11H

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,293
    RFQ
    10-6513-11H

    Datasheet

    10-6513-11H Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-2503-20

    08-2503-20

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,662
    RFQ
    08-2503-20

    Datasheet

    08-2503-20 503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-320-ZWTT

    ICA-320-ZWTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,430
    RFQ
    ICA-320-ZWTT

    Datasheet

    ICA-320-ZWTT ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    510-87-132-14-001101

    510-87-132-14-001101

    CONN SOCKET PGA 132POS GOLD

    Preci-Dip

    4,164
    RFQ
    510-87-132-14-001101

    Datasheet

    510-87-132-14-001101 510 Bulk Active PGA 132 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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