Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-83-316-41-013101

    116-83-316-41-013101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    3,725
    RFQ
    116-83-316-41-013101

    Datasheet

    116-83-316-41-013101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-632-STT

    ICO-632-STT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,940
    RFQ
    ICO-632-STT

    Datasheet

    ICO-632-STT ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    HLS-0109-T-18

    HLS-0109-T-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,526
    RFQ
    HLS-0109-T-18

    Datasheet

    HLS-0109-T-18 HLS Tube Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-87-632-41-011101

    116-87-632-41-011101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,811
    RFQ
    116-87-632-41-011101

    Datasheet

    116-87-632-41-011101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-640-41-105161

    110-83-640-41-105161

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    3,477
    RFQ
    110-83-640-41-105161

    Datasheet

    110-83-640-41-105161 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    5-1571552-4

    5-1571552-4

    CONN IC DIP SOCKET 48POS GOLD

    TE Connectivity AMP Connectors

    3,949
    RFQ
    5-1571552-4

    Datasheet

    5-1571552-4 800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    4734

    4734

    COVER PWR TRANS .210"ID TO-3

    Keystone Electronics

    4,317
    RFQ
    4734

    Datasheet

    4734 - Bulk Active - - - - - - - - - - - - - - -
    08-820-90C

    08-820-90C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,736
    RFQ
    08-820-90C

    Datasheet

    08-820-90C Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-822-90C

    08-822-90C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,733
    RFQ
    08-822-90C

    Datasheet

    08-822-90C Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-823-90C

    08-823-90C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,453
    RFQ
    08-823-90C

    Datasheet

    08-823-90C Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICO-316-KGT

    ICO-316-KGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,066
    RFQ
    ICO-316-KGT

    Datasheet

    ICO-316-KGT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    299-87-616-10-002101

    299-87-616-10-002101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    4,972
    RFQ
    299-87-616-10-002101

    Datasheet

    299-87-616-10-002101 299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0210-TT-12

    HLS-0210-TT-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,662
    RFQ
    HLS-0210-TT-12

    Datasheet

    HLS-0210-TT-12 HLS Tube Active SIP 20 (2 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    ICA-318-WTT

    ICA-318-WTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,396
    RFQ
    ICA-318-WTT

    Datasheet

    ICA-318-WTT ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    116-83-632-41-002101

    116-83-632-41-002101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,991
    RFQ
    116-83-632-41-002101

    Datasheet

    116-83-632-41-002101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    540-44-028-17-400004

    540-44-028-17-400004

    CONN SKT PLCC

    Mill-Max Manufacturing Corp.

    4,770
    RFQ
    540-44-028-17-400004

    Datasheet

    540-44-028-17-400004 540 Tape & Reel (TR) Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 100.0µin (2.54µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
    08-2511-11

    08-2511-11

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,879
    RFQ
    08-2511-11

    Datasheet

    08-2511-11 511 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    12-0508-20

    12-0508-20

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    3,082
    RFQ
    12-0508-20

    Datasheet

    12-0508-20 508 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    12-0508-30

    12-0508-30

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    4,772
    RFQ
    12-0508-30

    Datasheet

    12-0508-30 508 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    12-1508-20

    12-1508-20

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,616
    RFQ
    12-1508-20

    Datasheet

    12-1508-20 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
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