Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    510-87-145-15-081101

    510-87-145-15-081101

    CONN SOCKET PGA 145POS GOLD

    Preci-Dip

    3,392
    RFQ
    510-87-145-15-081101

    Datasheet

    510-87-145-15-081101 510 Bulk Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0503-T-2

    HLS-0503-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,823
    RFQ
    HLS-0503-T-2

    Datasheet

    HLS-0503-T-2 HLS Bulk Active SIP 15 (5 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    299-87-324-10-001101

    299-87-324-10-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,940
    RFQ
    299-87-324-10-001101

    Datasheet

    299-87-324-10-001101 299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-318-LGT

    ICO-318-LGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,231
    RFQ
    ICO-318-LGT

    Datasheet

    ICO-318-LGT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    916657-3

    916657-3

    CONN SOCKET PGA ZIF 321POS GOLD

    TE Connectivity AMP Connectors

    4,335
    RFQ
    916657-3

    Datasheet

    916657-3 - Tray Obsolete PGA, ZIF (ZIP) 321 (19 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
    146-87-642-41-035101

    146-87-642-41-035101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    3,985
    RFQ
    146-87-642-41-035101

    Datasheet

    146-87-642-41-035101 146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0113-G-2

    HLS-0113-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,916
    RFQ
    HLS-0113-G-2

    Datasheet

    HLS-0113-G-2 HLS Tube Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    ICF-316-SM-O

    ICF-316-SM-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,629
    RFQ
    ICF-316-SM-O

    Datasheet

    ICF-316-SM-O ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICA-422-ZWTT

    ICA-422-ZWTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,398
    RFQ
    ICA-422-ZWTT

    Datasheet

    ICA-422-ZWTT ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    4726

    4726

    SMT SOCKET - WIDE SOIC-8 (200MIL

    Adafruit Industries LLC

    4,100
    RFQ
    4726

    Datasheet

    4726 - Bulk Active SOIC 8 (2 x 4) 0.050" (1.27mm) - - - Surface Mount Closed Frame Solder 0.050" (1.27mm) - - - - -
    HLS-0106-G-3

    HLS-0106-G-3

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,308
    RFQ
    HLS-0106-G-3

    Datasheet

    HLS-0106-G-3 HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    12-3503-20

    12-3503-20

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,238
    RFQ
    12-3503-20

    Datasheet

    12-3503-20 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-3503-30

    12-3503-30

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,267
    RFQ
    12-3503-30

    Datasheet

    12-3503-30 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-3518-101

    20-3518-101

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,622
    RFQ
    20-3518-101

    Datasheet

    20-3518-101 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    40-6513-10T

    40-6513-10T

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,310
    RFQ
    40-6513-10T

    Datasheet

    40-6513-10T Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3513-11H

    14-3513-11H

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,683
    RFQ
    14-3513-11H

    Datasheet

    14-3513-11H Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-83-964-41-005101

    110-83-964-41-005101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    3,485
    RFQ
    110-83-964-41-005101

    Datasheet

    110-83-964-41-005101 110 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-640-T-I-TR

    ICF-640-T-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,374
    RFQ
    ICF-640-T-I-TR

    Datasheet

    ICF-640-T-I-TR ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    116-83-432-41-001101

    116-83-432-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,418
    RFQ
    116-83-432-41-001101

    Datasheet

    116-83-432-41-001101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-146-15-061101

    510-87-146-15-061101

    CONN SOCKET PGA 146POS GOLD

    Preci-Dip

    4,967
    RFQ
    510-87-146-15-061101

    Datasheet

    510-87-146-15-061101 510 Bulk Active PGA 146 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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