Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    31-0518-11

    31-0518-11

    CONN SOCKET SIP 31POS GOLD

    Aries Electronics

    4,299
    RFQ
    31-0518-11

    Datasheet

    31-0518-11 518 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-87-144-15-001101

    510-87-144-15-001101

    CONN SOCKET PGA 144POS GOLD

    Preci-Dip

    2,876
    RFQ
    510-87-144-15-001101

    Datasheet

    510-87-144-15-001101 510 Bulk Active PGA 144 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-144-15-081101

    510-87-144-15-081101

    CONN SOCKET PGA 144POS GOLD

    Preci-Dip

    2,482
    RFQ
    510-87-144-15-081101

    Datasheet

    510-87-144-15-081101 510 Bulk Active PGA 144 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-133-13-041101

    510-87-133-13-041101

    CONN SOCKET PGA 133POS GOLD

    Preci-Dip

    4,778
    RFQ
    510-87-133-13-041101

    Datasheet

    510-87-133-13-041101 510 Bulk Active PGA 133 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    PGA145H012B1-1521R

    PGA145H012B1-1521R

    PGA SOCKET 145 CTS

    Amphenol ICC (FCI)

    2,449
    RFQ
    PGA145H012B1-1521R

    Datasheet

    PGA145H012B1-1521R - - Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Through Hole Open Frame - - - - - - -
    28-C212-10T

    28-C212-10T

    CONN IC DIP SOCKET 28POS TIN

    Aries Electronics

    4,906
    RFQ
    28-C212-10T

    Datasheet

    28-C212-10T EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-6822-90C

    08-6822-90C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,187
    RFQ
    08-6822-90C

    Datasheet

    08-6822-90C Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APO-314-T-C

    APO-314-T-C

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,217
    RFQ
    APO-314-T-C

    Datasheet

    APO-314-T-C APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICO-308-ZCGG

    ICO-308-ZCGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,523
    RFQ
    ICO-308-ZCGG

    Datasheet

    ICO-308-ZCGG ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    612-83-650-41-001101

    612-83-650-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    3,962
    RFQ
    612-83-650-41-001101

    Datasheet

    612-83-650-41-001101 612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-964-41-001101

    614-87-964-41-001101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    4,244
    RFQ
    614-87-964-41-001101

    Datasheet

    614-87-964-41-001101 614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    08-3508-30

    08-3508-30

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,333
    RFQ
    08-3508-30

    Datasheet

    08-3508-30 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-0513-11H

    20-0513-11H

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    3,933
    RFQ
    20-0513-11H

    Datasheet

    20-0513-11H 0513 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-0513-11

    24-0513-11

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    4,666
    RFQ
    24-0513-11

    Datasheet

    24-0513-11 0513 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    25-0513-11

    25-0513-11

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    3,532
    RFQ
    25-0513-11

    Datasheet

    25-0513-11 0513 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    37-0518-11

    37-0518-11

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    4,662
    RFQ
    37-0518-11

    Datasheet

    37-0518-11 518 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-83-652-41-001101

    614-83-652-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    4,717
    RFQ
    614-83-652-41-001101

    Datasheet

    614-83-652-41-001101 614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    5-1437536-2

    5-1437536-2

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    4,597
    RFQ
    5-1437536-2

    Datasheet

    5-1437536-2 500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
    510-87-145-15-001101

    510-87-145-15-001101

    CONN SOCKET PGA 145POS GOLD

    Preci-Dip

    3,834
    RFQ
    510-87-145-15-001101

    Datasheet

    510-87-145-15-001101 510 Bulk Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-145-15-002101

    510-87-145-15-002101

    CONN SOCKET PGA 145POS GOLD

    Preci-Dip

    3,379
    RFQ
    510-87-145-15-002101

    Datasheet

    510-87-145-15-002101 510 Bulk Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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