Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APA-316-T-M

    APA-316-T-M

    ADAPTER PLUG

    Samtec Inc.

    3,583
    RFQ
    APA-316-T-M

    Datasheet

    APA-316-T-M APA Tube Active - 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-87-640-41-008101

    116-87-640-41-008101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    4,011
    RFQ
    116-87-640-41-008101

    Datasheet

    116-87-640-41-008101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-314-ZWGT-2

    ICA-314-ZWGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,309
    RFQ
    ICA-314-ZWGT-2

    Datasheet

    ICA-314-ZWGT-2 ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    24-3518-10M

    24-3518-10M

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,509
    RFQ
    24-3518-10M

    Datasheet

    24-3518-10M 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0205-G-22

    HLS-0205-G-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,622
    RFQ
    HLS-0205-G-22

    Datasheet

    HLS-0205-G-22 HLS Tube Active SIP 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    32-9513-10T

    32-9513-10T

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,581
    RFQ
    32-9513-10T

    Datasheet

    32-9513-10T Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3518-112

    14-3518-112

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,038
    RFQ
    14-3518-112

    Datasheet

    14-3518-112 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-822-90E

    08-822-90E

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    4,450
    RFQ
    08-822-90E

    Datasheet

    08-822-90E Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    299-87-324-11-001101

    299-87-324-11-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,137
    RFQ
    299-87-324-11-001101

    Datasheet

    299-87-324-11-001101 299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-624-S-I-TR

    ICF-624-S-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,331
    RFQ
    ICF-624-S-I-TR

    Datasheet

    ICF-624-S-I-TR ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    HLS-0207-G-2

    HLS-0207-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,249
    RFQ
    HLS-0207-G-2

    Datasheet

    HLS-0207-G-2 HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    540-44-052-17-400004

    540-44-052-17-400004

    CONN SKT PLCC

    Mill-Max Manufacturing Corp.

    3,249
    RFQ
    540-44-052-17-400004

    Datasheet

    540-44-052-17-400004 540 Tape & Reel (TR) Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
    APA-308-T-B

    APA-308-T-B

    ADAPTER PLUG

    Samtec Inc.

    4,497
    RFQ
    APA-308-T-B

    Datasheet

    APA-308-T-B APA Bulk Active - 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-308-T-B

    APO-308-T-B

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,740
    RFQ
    APO-308-T-B

    Datasheet

    APO-308-T-B APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-83-318-41-013101

    116-83-318-41-013101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,212
    RFQ
    116-83-318-41-013101

    Datasheet

    116-83-318-41-013101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-320-WTT

    ICA-320-WTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,836
    RFQ
    ICA-320-WTT

    Datasheet

    ICA-320-WTT ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    22-4501-20

    22-4501-20

    CONN IC DIP SOCKET 22POS TIN

    Aries Electronics

    4,544
    RFQ
    22-4501-20

    Datasheet

    22-4501-20 501 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-4501-30

    22-4501-30

    CONN IC DIP SOCKET 22POS TIN

    Aries Electronics

    3,213
    RFQ
    22-4501-30

    Datasheet

    22-4501-30 501 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    11-0503-20

    11-0503-20

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    3,432
    RFQ
    11-0503-20

    Datasheet

    11-0503-20 0503 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    11-0503-30

    11-0503-30

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    2,520
    RFQ
    11-0503-30

    Datasheet

    11-0503-30 0503 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
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