Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    A 28-LC-TR01

    A 28-LC-TR01

    28 (2 X 14) POS DIP, 0.3" (7.62M

    Assmann WSW Components

    3,605
    RFQ
    A 28-LC-TR01

    Datasheet

    A 28-LC-TR01 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    A-ICS-254-10-TT50

    A-ICS-254-10-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    2,244
    RFQ
    A-ICS-254-10-TT50

    Datasheet

    A-ICS-254-10-TT50 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR 20-HZL/07-TT

    AR 20-HZL/07-TT

    CONN IC DIP SOCKET 20POS GOLD

    Assmann WSW Components

    3,296
    RFQ
    AR 20-HZL/07-TT

    Datasheet

    AR 20-HZL/07-TT - Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    AR 40-HZL/01-TT

    AR 40-HZL/01-TT

    CONN IC DIP SOCKET 40POS GOLD

    Assmann WSW Components

    2,585
    RFQ
    AR 40-HZL/01-TT

    Datasheet

    AR 40-HZL/01-TT - Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    AR 40 HGL-TT

    AR 40 HGL-TT

    SOCKET

    Assmann WSW Components

    2,421
    RFQ

    -

    AR 40 HGL-TT AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR 36-HZL/01-TT

    AR 36-HZL/01-TT

    SOCKET

    Assmann WSW Components

    4,917
    RFQ

    -

    AR 36-HZL/01-TT AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR64-HZL-TT

    AR64-HZL-TT

    CONN IC DIP SOCKET 64POS TIN

    Assmann WSW Components

    4,619
    RFQ
    AR64-HZL-TT

    Datasheet

    AR64-HZL-TT - Bag Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    AR28-HZL/07-TT

    AR28-HZL/07-TT

    CONN IC DIP SOCKET 28POS GOLD

    Assmann WSW Components

    2,991
    RFQ
    AR28-HZL/07-TT

    Datasheet

    AR28-HZL/07-TT - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    AR28-HZW/T

    AR28-HZW/T

    CONN IC DIP SOCKET 28POS GOLD

    Assmann WSW Components

    4,781
    RFQ
    AR28-HZW/T

    Datasheet

    AR28-HZW/T - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    AR 24-HZL/07-TT

    AR 24-HZL/07-TT

    CONN IC DIP SOCKET 24POS GOLD

    Assmann WSW Components

    4,777
    RFQ
    AR 24-HZL/07-TT

    Datasheet

    AR 24-HZL/07-TT - Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
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