Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    A-ICS-254-16-TT50

    A-ICS-254-16-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    2,232
    RFQ
    A-ICS-254-16-TT50

    Datasheet

    A-ICS-254-16-TT50 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR40-HZL/07-TT

    AR40-HZL/07-TT

    CONN IC DIP SOCKET 40POS GOLD

    Assmann WSW Components

    3,442
    RFQ
    AR40-HZL/07-TT

    Datasheet

    AR40-HZL/07-TT - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    AJ 64-HZL-T

    AJ 64-HZL-T

    SOCKET

    Assmann WSW Components

    4,264
    RFQ

    -

    AJ 64-HZL-T - Bulk Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 196.9µin (5.00µm) Brass Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    AR 22-HZL/07/7-TT

    AR 22-HZL/07/7-TT

    SOCKET

    Assmann WSW Components

    4,522
    RFQ

    -

    AR 22-HZL/07/7-TT AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR 28-HZL/07/7-TT

    AR 28-HZL/07/7-TT

    CONN IC DIP SOCKET 28POS GOLD

    Assmann WSW Components

    4,598
    RFQ
    AR 28-HZL/07/7-TT

    Datasheet

    AR 28-HZL/07/7-TT - Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    AR 48 HZL/07-TT

    AR 48 HZL/07-TT

    CONN IC DIP SOCKET 48POS GOLD

    Assmann WSW Components

    3,786
    RFQ
    AR 48 HZL/07-TT

    Datasheet

    AR 48 HZL/07-TT - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    A-ICS-254-18-TT50

    A-ICS-254-18-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    3,646
    RFQ
    A-ICS-254-18-TT50

    Datasheet

    A-ICS-254-18-TT50 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR 36-HZL/07-TT

    AR 36-HZL/07-TT

    SOCKET

    Assmann WSW Components

    2,816
    RFQ

    -

    AR 36-HZL/07-TT AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR 40-HZL/07-TT

    AR 40-HZL/07-TT

    CONN IC DIP SOCKET 40POS GOLD

    Assmann WSW Components

    3,805
    RFQ
    AR 40-HZL/07-TT

    Datasheet

    AR 40-HZL/07-TT - Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    AR 64-HZL/01-TT

    AR 64-HZL/01-TT

    SOCKET

    Assmann WSW Components

    2,002
    RFQ

    -

    AR 64-HZL/01-TT AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    Total 326 Record«Prev1... 27282930313233Next»
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