Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    A40-LCG-T-R

    A40-LCG-T-R

    CONN IC DIP SOCKET 40POS GOLD

    Assmann WSW Components

    3,937
    RFQ
    A40-LCG-T-R

    Datasheet

    A40-LCG-T-R - Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    A-ICS-254-12-TT50

    A-ICS-254-12-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    3,251
    RFQ
    A-ICS-254-12-TT50

    Datasheet

    A-ICS-254-12-TT50 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 12 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    A48-LCG-T-R

    A48-LCG-T-R

    CONN IC DIP SOCKET 48POS GOLD

    Assmann WSW Components

    4,956
    RFQ
    A48-LCG-T-R

    Datasheet

    A48-LCG-T-R - Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    AR20-HZL/01-TT-R

    AR20-HZL/01-TT-R

    CONN IC DIP SOCKET 20POS GOLD

    Assmann WSW Components

    2,838
    RFQ
    AR20-HZL/01-TT-R

    Datasheet

    AR20-HZL/01-TT-R - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    AR 42-HZL/01-TT

    AR 42-HZL/01-TT

    SOCKET

    Assmann WSW Components

    4,850
    RFQ

    -

    AR 42-HZL/01-TT AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR 22-HZL/07-TT

    AR 22-HZL/07-TT

    SOCKET

    Assmann WSW Components

    2,408
    RFQ

    -

    AR 22-HZL/07-TT AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR32-HZL/07-TT

    AR32-HZL/07-TT

    CONN IC DIP SOCKET 32POS GOLD

    Assmann WSW Components

    4,117
    RFQ
    AR32-HZL/07-TT

    Datasheet

    AR32-HZL/07-TT - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    AR 48 HGL-TT

    AR 48 HGL-TT

    SOCKET

    Assmann WSW Components

    3,737
    RFQ

    -

    AR 48 HGL-TT AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR 48-HZL/01-TT

    AR 48-HZL/01-TT

    CONN IC DIP SOCKET 48POS GOLD

    Assmann WSW Components

    3,676
    RFQ
    AR 48-HZL/01-TT

    Datasheet

    AR 48-HZL/01-TT - Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    AR 22-HZL/01-TT

    AR 22-HZL/01-TT

    SOCKET

    Assmann WSW Components

    3,503
    RFQ

    -

    AR 22-HZL/01-TT AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
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