Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    16-3503-31

    16-3503-31

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,263
    RFQ
    16-3503-31

    Datasheet

    16-3503-31 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    30-3503-20

    30-3503-20

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,374
    RFQ
    30-3503-20

    Datasheet

    30-3503-20 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-3503-30

    30-3503-30

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    3,077
    RFQ
    30-3503-30

    Datasheet

    30-3503-30 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    210-11-310-41-001000

    210-11-310-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,265
    RFQ
    210-11-310-41-001000

    Datasheet

    210-11-310-41-001000 210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-306-41-007000

    116-93-306-41-007000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    2,093
    RFQ
    116-93-306-41-007000

    Datasheet

    116-93-306-41-007000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-306-41-007000

    116-43-306-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,667
    RFQ
    116-43-306-41-007000

    Datasheet

    116-43-306-41-007000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0317-T-2

    HLS-0317-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,062
    RFQ
    HLS-0317-T-2

    Datasheet

    HLS-0317-T-2 HLS Tube Active SIP 51 (3 x 17) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    546-83-085-11-002135

    546-83-085-11-002135

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    2,305
    RFQ
    546-83-085-11-002135

    Datasheet

    546-83-085-11-002135 546 Bulk Active PGA 85 (11 x 11) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-83-085-11-002136

    546-83-085-11-002136

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    3,337
    RFQ
    546-83-085-11-002136

    Datasheet

    546-83-085-11-002136 546 Bulk Active PGA 85 (11 x 11) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-810-90TWR

    20-810-90TWR

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    4,771
    RFQ
    20-810-90TWR

    Datasheet

    20-810-90TWR Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    146-41-308-41-012000

    146-41-308-41-012000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    2,849
    RFQ
    146-41-308-41-012000

    Datasheet

    146-41-308-41-012000 146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-91-308-41-012000

    146-91-308-41-012000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    3,927
    RFQ
    146-91-308-41-012000

    Datasheet

    146-91-308-41-012000 146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-13-306-41-770000

    104-13-306-41-770000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    3,090
    RFQ
    104-13-306-41-770000

    Datasheet

    104-13-306-41-770000 104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    110-43-210-41-001000

    110-43-210-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,667
    RFQ
    110-43-210-41-001000

    Datasheet

    110-43-210-41-001000 110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-320-ZWGG-2

    ICA-320-ZWGG-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,069
    RFQ
    ICA-320-ZWGG-2

    Datasheet

    ICA-320-ZWGG-2 ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICF-328-STL-I

    ICF-328-STL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,341
    RFQ
    ICF-328-STL-I

    Datasheet

    ICF-328-STL-I ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-628-STL-O

    ICF-628-STL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,496
    RFQ
    ICF-628-STL-O

    Datasheet

    ICF-628-STL-O ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-648-TL-O

    ICF-648-TL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,458
    RFQ
    ICF-648-TL-O

    Datasheet

    ICF-648-TL-O ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    APH-0918-T-T

    APH-0918-T-T

    APH-0918-T-T

    Samtec Inc.

    2,801
    RFQ

    -

    APH-0918-T-T * - Active - - - - - - - - - - - - - - -
    APH-1018-T-T

    APH-1018-T-T

    APH-1018-T-T

    Samtec Inc.

    4,630
    RFQ

    -

    APH-1018-T-T * - Active - - - - - - - - - - - - - - -
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