Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1718-T-T

    APH-1718-T-T

    APH-1718-T-T

    Samtec Inc.

    3,748
    RFQ

    -

    APH-1718-T-T * - Active - - - - - - - - - - - - - - -
    APH-0718-T-T

    APH-0718-T-T

    APH-0718-T-T

    Samtec Inc.

    2,850
    RFQ

    -

    APH-0718-T-T * - Active - - - - - - - - - - - - - - -
    APH-0318-T-T

    APH-0318-T-T

    APH-0318-T-T

    Samtec Inc.

    4,007
    RFQ

    -

    APH-0318-T-T * - Active - - - - - - - - - - - - - - -
    116-41-308-41-006000

    116-41-308-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,484
    RFQ
    116-41-308-41-006000

    Datasheet

    116-41-308-41-006000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-308-41-006000

    116-91-308-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,398
    RFQ
    116-91-308-41-006000

    Datasheet

    116-91-308-41-006000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-41-103-41-005000

    917-41-103-41-005000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    4,540
    RFQ
    917-41-103-41-005000

    Datasheet

    917-41-103-41-005000 917 Tube Active Transistor, TO-5 3 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-91-103-41-005000

    917-91-103-41-005000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    4,505
    RFQ
    917-91-103-41-005000

    Datasheet

    917-91-103-41-005000 917 Tube Active Transistor, TO-5 3 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-83-642-41-013101

    116-83-642-41-013101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    3,905
    RFQ
    116-83-642-41-013101

    Datasheet

    116-83-642-41-013101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    30-9513-10H

    30-9513-10H

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    4,011
    RFQ
    30-9513-10H

    Datasheet

    30-9513-10H Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-99-322-41-001000

    110-99-322-41-001000

    CONN IC DIP SOCKET 22POS TINLEAD

    Mill-Max Manufacturing Corp.

    3,341
    RFQ
    110-99-322-41-001000

    Datasheet

    110-99-322-41-001000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-44-322-41-001000

    110-44-322-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,673
    RFQ
    110-44-322-41-001000

    Datasheet

    110-44-322-41-001000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-44-422-41-001000

    110-44-422-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,339
    RFQ
    110-44-422-41-001000

    Datasheet

    110-44-422-41-001000 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-41-103-41-001000

    917-41-103-41-001000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    2,677
    RFQ
    917-41-103-41-001000

    Datasheet

    917-41-103-41-001000 917 Tube Active Transistor, TO-5 3 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-11-308-41-001000

    210-11-308-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,366
    RFQ
    210-11-308-41-001000

    Datasheet

    210-11-308-41-001000 210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0313-T-10

    HLS-0313-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,801
    RFQ
    HLS-0313-T-10

    Datasheet

    HLS-0313-T-10 HLS Tube Active SIP 39 (3 x 13) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    20-3508-30

    20-3508-30

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,905
    RFQ
    20-3508-30

    Datasheet

    20-3508-30 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8450-610C

    16-8450-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,123
    RFQ
    16-8450-610C

    Datasheet

    16-8450-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8500-610C

    16-8500-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,900
    RFQ
    16-8500-610C

    Datasheet

    16-8500-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-0410-T-2

    HLS-0410-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,131
    RFQ
    HLS-0410-T-2

    Datasheet

    HLS-0410-T-2 HLS Bulk Active SIP 40 (4 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    210-99-324-41-001000

    210-99-324-41-001000

    CONN IC DIP SOCKET 24POS TINLEAD

    Mill-Max Manufacturing Corp.

    4,955
    RFQ
    210-99-324-41-001000

    Datasheet

    210-99-324-41-001000 210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 467468469470471472473474...955Next»
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