Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    20-81250-610C

    20-81250-610C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,143
    RFQ
    20-81250-610C

    Datasheet

    20-81250-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8400-610C

    20-8400-610C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,816
    RFQ
    20-8400-610C

    Datasheet

    20-8400-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8500-610C

    20-8500-610C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,653
    RFQ
    20-8500-610C

    Datasheet

    20-8500-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8675-610C

    20-8675-610C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,818
    RFQ
    20-8675-610C

    Datasheet

    20-8675-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8724-610C

    20-8724-610C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,129
    RFQ
    20-8724-610C

    Datasheet

    20-8724-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8950-610C

    20-8950-610C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,194
    RFQ
    20-8950-610C

    Datasheet

    20-8950-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    66-PGM11054-10

    66-PGM11054-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,583
    RFQ
    66-PGM11054-10

    Datasheet

    66-PGM11054-10 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    48-6513-10H

    48-6513-10H

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    3,332
    RFQ
    48-6513-10H

    Datasheet

    48-6513-10H Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-0501-30

    17-0501-30

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    3,912
    RFQ
    17-0501-30

    Datasheet

    17-0501-30 501 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    64-9518-11

    64-9518-11

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    4,565
    RFQ
    64-9518-11

    Datasheet

    64-9518-11 518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    346-93-145-41-013000

    346-93-145-41-013000

    CONN SOCKET SIP 45POS GOLD

    Mill-Max Manufacturing Corp.

    3,091
    RFQ
    346-93-145-41-013000

    Datasheet

    346-93-145-41-013000 346 Bulk Active SIP 45 (1 x 45) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-145-41-013000

    346-43-145-41-013000

    CONN SOCKET SIP 45POS GOLD

    Mill-Max Manufacturing Corp.

    2,756
    RFQ
    346-43-145-41-013000

    Datasheet

    346-43-145-41-013000 346 Bulk Active SIP 45 (1 x 45) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-93-306-11-480000

    605-93-306-11-480000

    SOCKET CARRIER LOWPRO .300 6POS

    Mill-Max Manufacturing Corp.

    2,509
    RFQ
    605-93-306-11-480000

    Datasheet

    605-93-306-11-480000 605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-306-11-480000

    605-43-306-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    2,274
    RFQ
    605-43-306-11-480000

    Datasheet

    605-43-306-11-480000 605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0218-T-11

    HLS-0218-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,842
    RFQ
    HLS-0218-T-11

    Datasheet

    HLS-0218-T-11 HLS Tube Active SIP 36 (2 x 18) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    HLS-0217-G-2

    HLS-0217-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,391
    RFQ
    HLS-0217-G-2

    Datasheet

    HLS-0217-G-2 HLS Tube Active SIP 34 (2 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    116-41-310-41-003000

    116-41-310-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,429
    RFQ
    116-41-310-41-003000

    Datasheet

    116-41-310-41-003000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-310-41-003000

    116-91-310-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,969
    RFQ
    116-91-310-41-003000

    Datasheet

    116-91-310-41-003000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-PGM06002-10

    28-PGM06002-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,561
    RFQ
    28-PGM06002-10

    Datasheet

    28-PGM06002-10 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    114-93-308-41-117000

    114-93-308-41-117000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    3,898
    RFQ
    114-93-308-41-117000

    Datasheet

    114-93-308-41-117000 114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 469470471472473474475476...955Next»
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