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    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-43-310-41-008000

    116-43-310-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,021
    RFQ
    116-43-310-41-008000

    Datasheet

    116-43-310-41-008000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-310-41-001000

    126-43-310-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,319
    RFQ
    126-43-310-41-001000

    Datasheet

    126-43-310-41-001000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-308-41-001000

    116-41-308-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,532
    RFQ
    116-41-308-41-001000

    Datasheet

    116-41-308-41-001000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-308-41-001000

    116-91-308-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,704
    RFQ
    116-91-308-41-001000

    Datasheet

    116-91-308-41-001000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-308-31-018000

    614-41-308-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,922
    RFQ
    614-41-308-31-018000

    Datasheet

    614-41-308-31-018000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-308-31-018000

    614-91-308-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,498
    RFQ
    614-91-308-31-018000

    Datasheet

    614-91-308-31-018000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-93-320-41-001000

    210-93-320-41-001000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    3,724
    RFQ
    210-93-320-41-001000

    Datasheet

    210-93-320-41-001000 210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-47-428-41-001000

    115-47-428-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    3,126
    RFQ
    115-47-428-41-001000

    Datasheet

    115-47-428-41-001000 115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-636-41-001000

    110-99-636-41-001000

    CONN IC DIP SOCKET 36POS TINLEAD

    Mill-Max Manufacturing Corp.

    2,459
    RFQ
    110-99-636-41-001000

    Datasheet

    110-99-636-41-001000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    85-PGM11007-10

    85-PGM11007-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,915
    RFQ
    85-PGM11007-10

    Datasheet

    85-PGM11007-10 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    111-41-322-41-001000

    111-41-322-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,200
    RFQ
    111-41-322-41-001000

    Datasheet

    111-41-322-41-001000 111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-41-422-41-001000

    111-41-422-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,254
    RFQ
    111-41-422-41-001000

    Datasheet

    111-41-422-41-001000 111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-91-322-41-001000

    111-91-322-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,670
    RFQ
    111-91-322-41-001000

    Datasheet

    111-91-322-41-001000 111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-91-422-41-001000

    111-91-422-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,588
    RFQ
    111-91-422-41-001000

    Datasheet

    111-91-422-41-001000 111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    514-87-127-16-091117

    514-87-127-16-091117

    CONN SOCKET PGA 127POS GOLD

    Preci-Dip

    4,930
    RFQ
    514-87-127-16-091117

    Datasheet

    514-87-127-16-091117 514 Bulk Active PGA 127 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-11-314-41-001000

    110-11-314-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,888
    RFQ
    110-11-314-41-001000

    Datasheet

    110-11-314-41-001000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-322-41-105000

    110-41-322-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,649
    RFQ
    110-41-322-41-105000

    Datasheet

    110-41-322-41-105000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-422-41-105000

    110-41-422-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,582
    RFQ
    110-41-422-41-105000

    Datasheet

    110-41-422-41-105000 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-322-41-105000

    110-91-322-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,965
    RFQ
    110-91-322-41-105000

    Datasheet

    110-91-322-41-105000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-422-41-105000

    110-91-422-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,077
    RFQ
    110-91-422-41-105000

    Datasheet

    110-91-422-41-105000 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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