Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    44-PGM08003-10

    44-PGM08003-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,492
    RFQ
    44-PGM08003-10

    Datasheet

    44-PGM08003-10 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICO-624-ZNGG

    ICO-624-ZNGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,228
    RFQ
    ICO-624-ZNGG

    Datasheet

    ICO-624-ZNGG ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    550-10-069-11-001101

    550-10-069-11-001101

    PGA SOLDER TAIL

    Preci-Dip

    3,662
    RFQ
    550-10-069-11-001101

    Datasheet

    550-10-069-11-001101 550 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    550-10-069-11-061101

    550-10-069-11-061101

    PGA SOLDER TAIL

    Preci-Dip

    3,627
    RFQ
    550-10-069-11-061101

    Datasheet

    550-10-069-11-061101 550 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-91-304-61-001000

    110-91-304-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,151
    RFQ

    -

    110-91-304-61-001000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-93-110-41-005000

    317-93-110-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    3,869
    RFQ
    317-93-110-41-005000

    Datasheet

    317-93-110-41-005000 317 Tube Active SIP 10 (1 x 10) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-41-628-41-001000

    210-41-628-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,895
    RFQ
    210-41-628-41-001000

    Datasheet

    210-41-628-41-001000 210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-91-628-41-001000

    210-91-628-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,867
    RFQ
    210-91-628-41-001000

    Datasheet

    210-91-628-41-001000 210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-41-308-41-002000

    126-41-308-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,653
    RFQ
    126-41-308-41-002000

    Datasheet

    126-41-308-41-002000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-308-41-002000

    126-91-308-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,666
    RFQ
    126-91-308-41-002000

    Datasheet

    126-91-308-41-002000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-93-111-41-005000

    317-93-111-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    2,367
    RFQ
    317-93-111-41-005000

    Datasheet

    317-93-111-41-005000 317 Bulk Active SIP 11 (1 x 11) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-310-41-001000

    116-41-310-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,836
    RFQ
    116-41-310-41-001000

    Datasheet

    116-41-310-41-001000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-310-41-001000

    116-91-310-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,084
    RFQ
    116-91-310-41-001000

    Datasheet

    116-91-310-41-001000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-232-17-061101

    510-83-232-17-061101

    CONN SOCKET PGA 232POS GOLD

    Preci-Dip

    4,909
    RFQ
    510-83-232-17-061101

    Datasheet

    510-83-232-17-061101 510 Bulk Active PGA 232 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    299-99-210-12-001800

    299-99-210-12-001800

    CONN IC DIP SOCKET 10POS TINLEAD

    Mill-Max Manufacturing Corp.

    4,296
    RFQ
    299-99-210-12-001800

    Datasheet

    299-99-210-12-001800 299 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-11-314-41-001000

    210-11-314-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,753
    RFQ
    210-11-314-41-001000

    Datasheet

    210-11-314-41-001000 210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-310-31-012000

    614-93-310-31-012000

    SOCKET CARRIER LOWPRO .300 10POS

    Mill-Max Manufacturing Corp.

    2,876
    RFQ
    614-93-310-31-012000

    Datasheet

    614-93-310-31-012000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-310-31-012000

    614-43-310-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,120
    RFQ
    614-43-310-31-012000

    Datasheet

    614-43-310-31-012000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    30-0508-20

    30-0508-20

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    3,972
    RFQ
    30-0508-20

    Datasheet

    30-0508-20 508 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    114-93-314-41-117000

    114-93-314-41-117000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    2,502
    RFQ
    114-93-314-41-117000

    Datasheet

    114-93-314-41-117000 114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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