Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1606-G-H

    APH-1606-G-H

    APH-1606-G-H

    Samtec Inc.

    4,294
    RFQ

    -

    APH-1606-G-H * - Active - - - - - - - - - - - - - - -
    APH-1206-G-H

    APH-1206-G-H

    APH-1206-G-H

    Samtec Inc.

    3,486
    RFQ

    -

    APH-1206-G-H * - Active - - - - - - - - - - - - - - -
    APH-0406-G-H

    APH-0406-G-H

    APH-0406-G-H

    Samtec Inc.

    2,545
    RFQ

    -

    APH-0406-G-H * - Active - - - - - - - - - - - - - - -
    APH-1706-G-H

    APH-1706-G-H

    APH-1706-G-H

    Samtec Inc.

    3,268
    RFQ

    -

    APH-1706-G-H * - Active - - - - - - - - - - - - - - -
    APH-1806-G-H

    APH-1806-G-H

    APH-1806-G-H

    Samtec Inc.

    3,705
    RFQ

    -

    APH-1806-G-H * - Active - - - - - - - - - - - - - - -
    APH-0706-G-H

    APH-0706-G-H

    APH-0706-G-H

    Samtec Inc.

    3,720
    RFQ

    -

    APH-0706-G-H * - Active - - - - - - - - - - - - - - -
    HLS-0215-G-10

    HLS-0215-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,487
    RFQ
    HLS-0215-G-10

    Datasheet

    HLS-0215-G-10 HLS Tube Active SIP 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    18-6810-90

    18-6810-90

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,272
    RFQ
    18-6810-90

    Datasheet

    18-6810-90 Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    22-81150-610C

    22-81150-610C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,898
    RFQ
    22-81150-610C

    Datasheet

    22-81150-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-81250-310C

    22-81250-310C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,677
    RFQ
    22-81250-310C

    Datasheet

    22-81250-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-81250-610C

    22-81250-610C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,691
    RFQ
    22-81250-610C

    Datasheet

    22-81250-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-8500-610C

    22-8500-610C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,425
    RFQ
    22-8500-610C

    Datasheet

    22-8500-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-8600-610C

    22-8600-610C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,054
    RFQ
    22-8600-610C

    Datasheet

    22-8600-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-8850-610C

    22-8850-610C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    2,994
    RFQ
    22-8850-610C

    Datasheet

    22-8850-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    605-93-310-11-480000

    605-93-310-11-480000

    SOCKET CARRIER LOWPRO .300 10POS

    Mill-Max Manufacturing Corp.

    3,807
    RFQ
    605-93-310-11-480000

    Datasheet

    605-93-310-11-480000 605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-310-11-480000

    605-43-310-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    2,056
    RFQ
    605-43-310-11-480000

    Datasheet

    605-43-310-11-480000 605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-428-41-001000

    110-91-428-41-001000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    2,856
    RFQ
    110-91-428-41-001000

    Datasheet

    110-91-428-41-001000 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-428-41-001000

    110-41-428-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,110
    RFQ
    110-41-428-41-001000

    Datasheet

    110-41-428-41-001000 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-310-41-008000

    116-93-310-41-008000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    4,985
    RFQ
    116-93-310-41-008000

    Datasheet

    116-93-310-41-008000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-93-310-41-001000

    126-93-310-41-001000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    4,595
    RFQ
    126-93-310-41-001000

    Datasheet

    126-93-310-41-001000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 502503504505506507508509...955Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER