Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    HLS-0111-G-3

    HLS-0111-G-3

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,254
    RFQ
    HLS-0111-G-3

    Datasheet

    HLS-0111-G-3 HLS Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    38-3503-20

    38-3503-20

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    3,539
    RFQ
    38-3503-20

    Datasheet

    38-3503-20 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    38-3503-30

    38-3503-30

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    2,935
    RFQ
    38-3503-30

    Datasheet

    38-3503-30 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-6503-30

    40-6503-30

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,058
    RFQ
    40-6503-30

    Datasheet

    40-6503-30 503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-516-11M

    24-516-11M

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    2,481
    RFQ
    24-516-11M

    Datasheet

    24-516-11M 516 Bulk Active DIP, ZIF (ZIP) 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
    115-47-652-41-001000

    115-47-652-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,234
    RFQ
    115-47-652-41-001000

    Datasheet

    115-47-652-41-001000 115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    42-1508-20

    42-1508-20

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    2,727
    RFQ
    42-1508-20

    Datasheet

    42-1508-20 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    ICO-628-CGG

    ICO-628-CGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,931
    RFQ
    ICO-628-CGG

    Datasheet

    ICO-628-CGG ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    APA-628-G-J

    APA-628-G-J

    ADAPTER PLUG

    Samtec Inc.

    2,477
    RFQ
    APA-628-G-J

    Datasheet

    APA-628-G-J APA Bulk Active - 28 (2 x 14) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    111-41-640-41-001000

    111-41-640-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,589
    RFQ
    111-41-640-41-001000

    Datasheet

    111-41-640-41-001000 111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-91-640-41-001000

    111-91-640-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,517
    RFQ
    111-91-640-41-001000

    Datasheet

    111-91-640-41-001000 111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-13-314-41-780000

    104-13-314-41-780000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    3,820
    RFQ
    104-13-314-41-780000

    Datasheet

    104-13-314-41-780000 104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    16-C280-20

    16-C280-20

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,546
    RFQ
    16-C280-20

    Datasheet

    16-C280-20 EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-6508-202

    24-6508-202

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,271
    RFQ
    24-6508-202

    Datasheet

    24-6508-202 508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    146-93-422-41-012000

    146-93-422-41-012000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    2,716
    RFQ
    146-93-422-41-012000

    Datasheet

    146-93-422-41-012000 146 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-43-422-41-012000

    146-43-422-41-012000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    4,768
    RFQ
    146-43-422-41-012000

    Datasheet

    146-43-422-41-012000 146 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0930-T-T

    APH-0930-T-T

    APH-0930-T-T

    Samtec Inc.

    4,692
    RFQ

    -

    APH-0930-T-T * - Active - - - - - - - - - - - - - - -
    APH-0530-T-T

    APH-0530-T-T

    APH-0530-T-T

    Samtec Inc.

    4,158
    RFQ

    -

    APH-0530-T-T * - Active - - - - - - - - - - - - - - -
    APH-0630-T-T

    APH-0630-T-T

    APH-0630-T-T

    Samtec Inc.

    4,712
    RFQ

    -

    APH-0630-T-T * - Active - - - - - - - - - - - - - - -
    APH-1230-T-T

    APH-1230-T-T

    APH-1230-T-T

    Samtec Inc.

    3,087
    RFQ

    -

    APH-1230-T-T * - Active - - - - - - - - - - - - - - -
    Total 19086 Record«Prev1... 570571572573574575576577...955Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER