Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    28-8670-610C

    28-8670-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,502
    RFQ
    28-8670-610C

    Datasheet

    28-8670-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8675-610C

    28-8675-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,405
    RFQ
    28-8675-610C

    Datasheet

    28-8675-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8680-610C

    28-8680-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,519
    RFQ
    28-8680-610C

    Datasheet

    28-8680-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8700-610C

    28-8700-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,381
    RFQ
    28-8700-610C

    Datasheet

    28-8700-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8725-610C

    28-8725-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,347
    RFQ
    28-8725-610C

    Datasheet

    28-8725-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8750-610C

    28-8750-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,592
    RFQ
    28-8750-610C

    Datasheet

    28-8750-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8800-610C

    28-8800-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,920
    RFQ
    28-8800-610C

    Datasheet

    28-8800-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8830-610C

    28-8830-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,822
    RFQ
    28-8830-610C

    Datasheet

    28-8830-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    605-93-324-11-480000

    605-93-324-11-480000

    SOCKET CARRIER LOWPRO .300 24POS

    Mill-Max Manufacturing Corp.

    4,355
    RFQ
    605-93-324-11-480000

    Datasheet

    605-93-324-11-480000 605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-93-424-11-480000

    605-93-424-11-480000

    SOCKET CARRIER LOWPRO .400 24POS

    Mill-Max Manufacturing Corp.

    2,306
    RFQ
    605-93-424-11-480000

    Datasheet

    605-93-424-11-480000 605 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-93-624-11-480000

    605-93-624-11-480000

    SOCKET CARRIER LOWPRO .600 24POS

    Mill-Max Manufacturing Corp.

    2,466
    RFQ
    605-93-624-11-480000

    Datasheet

    605-93-624-11-480000 605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-324-11-480000

    605-43-324-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    3,409
    RFQ
    605-43-324-11-480000

    Datasheet

    605-43-324-11-480000 605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-424-11-480000

    605-43-424-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    4,649
    RFQ
    605-43-424-11-480000

    Datasheet

    605-43-424-11-480000 605 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-624-11-480000

    605-43-624-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    2,021
    RFQ
    605-43-624-11-480000

    Datasheet

    605-43-624-11-480000 605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-41-632-41-013000

    146-41-632-41-013000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    3,153
    RFQ
    146-41-632-41-013000

    Datasheet

    146-41-632-41-013000 146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-91-632-41-013000

    146-91-632-41-013000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    4,704
    RFQ
    146-91-632-41-013000

    Datasheet

    146-91-632-41-013000 146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-432-41-007000

    116-47-432-41-007000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    3,062
    RFQ
    116-47-432-41-007000

    Datasheet

    116-47-432-41-007000 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-632-41-007000

    116-47-632-41-007000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    2,195
    RFQ
    116-47-632-41-007000

    Datasheet

    116-47-632-41-007000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    TMJ03DKSD-S1512

    TMJ03DKSD-S1512

    CONN TRANSIST TO-254 3POS GOLD

    Sullins Connector Solutions

    2,791
    RFQ
    TMJ03DKSD-S1512

    Datasheet

    TMJ03DKSD-S1512 - Tube Active Transistor, TO-254 3 (Rectangular) 0.150" (3.81mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Flange Solder 0.150" (3.81mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS) -50°C ~ 175°C
    40-6508-301

    40-6508-301

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,367
    RFQ
    40-6508-301

    Datasheet

    40-6508-301 508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 612613614615616617618619...955Next»
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