Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    7010321946

    7010321946

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    3,766
    RFQ

    -

    7010321946 - Bulk Active - - - - - - - - - - - - - - -
    558-10-420M26-001101

    558-10-420M26-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    2,432
    RFQ
    558-10-420M26-001101

    Datasheet

    558-10-420M26-001101 558 Bulk Active PGA 420 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    42-6556-41

    42-6556-41

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    4,857
    RFQ
    42-6556-41

    Datasheet

    42-6556-41 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    518-77-388M26-001106

    518-77-388M26-001106

    CONN SOCKET PGA 388POS GOLD

    Preci-Dip

    2,996
    RFQ
    518-77-388M26-001106

    Datasheet

    518-77-388M26-001106 518 Bulk Active PGA 388 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    514-83-478M26-131148

    514-83-478M26-131148

    CONN SOCKET BGA 478POS GOLD

    Preci-Dip

    4,404
    RFQ
    514-83-478M26-131148

    Datasheet

    514-83-478M26-131148 514 Bulk Active BGA 478 (26 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    558-10-400M20-000104

    558-10-400M20-000104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    2,036
    RFQ
    558-10-400M20-000104

    Datasheet

    558-10-400M20-000104 558 Bulk Active BGA 400 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    223-33-320-41-001000

    223-33-320-41-001000

    STANDARD WIRE WRAP DIP SOCKET

    Mill-Max Manufacturing Corp.

    3,963
    RFQ

    -

    223-33-320-41-001000 - Tube Active - - - - - - - - - - - - - - -
    514-83-480M29-001148

    514-83-480M29-001148

    CONN SOCKET BGA 480POS GOLD

    Preci-Dip

    2,709
    RFQ
    514-83-480M29-001148

    Datasheet

    514-83-480M29-001148 514 Bulk Active BGA 480 (29 x 29) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    518-77-400M20-000105

    518-77-400M20-000105

    CONN SOCKET PGA 400POS GOLD

    Preci-Dip

    2,654
    RFQ
    518-77-400M20-000105

    Datasheet

    518-77-400M20-000105 518 Bulk Active PGA 400 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    110-33-640-41-001000

    110-33-640-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    3,145
    RFQ

    -

    110-33-640-41-001000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
    210-33-640-41-001000

    210-33-640-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    2,760
    RFQ
    210-33-640-41-001000

    Datasheet

    210-33-640-41-001000 210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
    65-PRS10008-12

    65-PRS10008-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,368
    RFQ
    65-PRS10008-12

    Datasheet

    65-PRS10008-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    550-10-652M35-001166

    550-10-652M35-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    4,557
    RFQ
    550-10-652M35-001166

    Datasheet

    550-10-652M35-001166 550 Bulk Active BGA 652 (35 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    66-PLS11054-12

    66-PLS11054-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,683
    RFQ
    66-PLS11054-12

    Datasheet

    66-PLS11054-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    550-10-456M26-001152

    550-10-456M26-001152

    BGA SOLDER TAIL

    Preci-Dip

    4,746
    RFQ
    550-10-456M26-001152

    Datasheet

    550-10-456M26-001152 550 Bulk Active BGA 456 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    546-83-528-21-121147

    546-83-528-21-121147

    CONN SOCKET PGA 528POS GOLD

    Preci-Dip

    4,680
    RFQ
    546-83-528-21-121147

    Datasheet

    546-83-528-21-121147 546 Bulk Active PGA 528 (21 x 21) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    558-10-432M31-001101

    558-10-432M31-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    4,165
    RFQ
    558-10-432M31-001101

    Datasheet

    558-10-432M31-001101 558 Bulk Active PGA 432 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    68-PLS11033-12

    68-PLS11033-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,783
    RFQ
    68-PLS11033-12

    Datasheet

    68-PLS11033-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    546-83-529-21-121147

    546-83-529-21-121147

    CONN SOCKET PGA 529POS GOLD

    Preci-Dip

    3,422
    RFQ
    546-83-529-21-121147

    Datasheet

    546-83-529-21-121147 546 Bulk Active PGA 529 (21 x 21) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    42-3554-16

    42-3554-16

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    3,759
    RFQ
    42-3554-16

    Datasheet

    42-3554-16 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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