Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    546-83-296-19-131147

    546-83-296-19-131147

    CONN SOCKET PGA 296POS GOLD

    Preci-Dip

    3,354
    RFQ
    546-83-296-19-131147

    Datasheet

    546-83-296-19-131147 546 Bulk Active PGA 296 (19 x 19) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    514-83-500M30-001148

    514-83-500M30-001148

    CONN SOCKET BGA 500POS GOLD

    Preci-Dip

    3,637
    RFQ
    514-83-500M30-001148

    Datasheet

    514-83-500M30-001148 514 Bulk Active BGA 500 (30 x 30) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    558-10-420M26-001104

    558-10-420M26-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    3,124
    RFQ
    558-10-420M26-001104

    Datasheet

    558-10-420M26-001104 558 Bulk Active BGA 420 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    84-PRS11010-12

    84-PRS11010-12

    ZIF 11X11 84PIN FOOTPRN 11010

    Aries Electronics

    2,711
    RFQ

    -

    84-PRS11010-12 PRS - Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -
    84-PLS10003-12

    84-PLS10003-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,180
    RFQ
    84-PLS10003-12

    Datasheet

    84-PLS10003-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    84-PRS10003-12

    84-PRS10003-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,764
    RFQ
    84-PRS10003-12

    Datasheet

    84-PRS10003-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    84-PRS11032-12

    84-PRS11032-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,285
    RFQ
    84-PRS11032-12

    Datasheet

    84-PRS11032-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    84-PRS12022-12

    84-PRS12022-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,132
    RFQ
    84-PRS12022-12

    Datasheet

    84-PRS12022-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    84-PRS13053-12

    84-PRS13053-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,804
    RFQ
    84-PRS13053-12

    Datasheet

    84-PRS13053-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    84-PRS13125-12

    84-PRS13125-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,628
    RFQ
    84-PRS13125-12

    Datasheet

    84-PRS13125-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    514-83-504M29-001148

    514-83-504M29-001148

    CONN SOCKET BGA 504POS GOLD

    Preci-Dip

    4,725
    RFQ
    514-83-504M29-001148

    Datasheet

    514-83-504M29-001148 514 Bulk Active BGA 504 (29 x 29) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    518-77-420M26-001105

    518-77-420M26-001105

    CONN SOCKET PGA 420POS GOLD

    Preci-Dip

    4,743
    RFQ
    518-77-420M26-001105

    Datasheet

    518-77-420M26-001105 518 Bulk Active PGA 420 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    514-87-652M35-001148

    514-87-652M35-001148

    CONN SOCKET BGA 652POS GOLD

    Preci-Dip

    4,540
    RFQ
    514-87-652M35-001148

    Datasheet

    514-87-652M35-001148 514 Bulk Active BGA 652 (35 x 35) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    44-3573-16

    44-3573-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    3,473
    RFQ
    44-3573-16

    Datasheet

    44-3573-16 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    550-10-478M26-131152

    550-10-478M26-131152

    BGA SOLDER TAIL

    Preci-Dip

    4,742
    RFQ
    550-10-478M26-131152

    Datasheet

    550-10-478M26-131152 550 Bulk Active BGA 478 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Open Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    HLS-1015-T-12

    HLS-1015-T-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,296
    RFQ
    HLS-1015-T-12

    Datasheet

    HLS-1015-T-12 HLS Bulk Active SIP 150 (10 x 15) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    550-10-480M29-001152

    550-10-480M29-001152

    BGA SOLDER TAIL

    Preci-Dip

    4,248
    RFQ
    550-10-480M29-001152

    Datasheet

    550-10-480M29-001152 550 Bulk Active BGA 480 (29 x 29) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    18-PRS17041-12

    18-PRS17041-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,357
    RFQ
    18-PRS17041-12

    Datasheet

    18-PRS17041-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    56-PRS15057-12

    56-PRS15057-12

    ZIF PGA SOCKET 56PIN 15X15

    Aries Electronics

    2,040
    RFQ

    -

    56-PRS15057-12 PRS - Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -
    56-PLS15057-12

    56-PLS15057-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,128
    RFQ
    56-PLS15057-12

    Datasheet

    56-PLS15057-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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