Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    69-PLS11031-12

    69-PLS11031-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,529
    RFQ
    69-PLS11031-12

    Datasheet

    69-PLS11031-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    69-PLS13112-12

    69-PLS13112-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,369
    RFQ
    69-PLS13112-12

    Datasheet

    69-PLS13112-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    69-PRS11031-12

    69-PRS11031-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,260
    RFQ
    69-PRS11031-12

    Datasheet

    69-PRS11031-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    69-PRS11055-12

    69-PRS11055-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,190
    RFQ
    69-PRS11055-12

    Datasheet

    69-PRS11055-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    69-PRS13112-12

    69-PRS13112-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,172
    RFQ
    69-PRS13112-12

    Datasheet

    69-PRS13112-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    518-77-400M20-000106

    518-77-400M20-000106

    CONN SOCKET PGA 400POS GOLD

    Preci-Dip

    4,288
    RFQ
    518-77-400M20-000106

    Datasheet

    518-77-400M20-000106 518 Bulk Active PGA 400 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    20-PLS13120-12

    20-PLS13120-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,925
    RFQ
    20-PLS13120-12

    Datasheet

    20-PLS13120-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    20-PRS13120-12

    20-PRS13120-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,763
    RFQ
    20-PRS13120-12

    Datasheet

    20-PRS13120-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    36-3553-16

    36-3553-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    4,040
    RFQ
    36-3553-16

    Datasheet

    36-3553-16 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6551-16

    36-6551-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    3,909
    RFQ
    36-6551-16

    Datasheet

    36-6551-16 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6552-16

    36-6552-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    2,425
    RFQ
    36-6552-16

    Datasheet

    36-6552-16 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6553-16

    36-6553-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    4,395
    RFQ
    36-6553-16

    Datasheet

    36-6553-16 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    36-3552-16

    36-3552-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    3,704
    RFQ
    36-3552-16

    Datasheet

    36-3552-16 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-3554-16

    36-3554-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    3,335
    RFQ
    36-3554-16

    Datasheet

    36-3554-16 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6554-16

    36-6554-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    3,561
    RFQ
    36-6554-16

    Datasheet

    36-6554-16 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    550-80-361-18-101135

    550-80-361-18-101135

    PGA SOLDER TAIL

    Preci-Dip

    2,801
    RFQ
    550-80-361-18-101135

    Datasheet

    550-80-361-18-101135 550 Bulk Active PGA 361 (18 x 18) 0.050" (1.27mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    192-PGM17043-10H

    192-PGM17043-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,322
    RFQ
    192-PGM17043-10H

    Datasheet

    192-PGM17043-10H PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    44-6556-41

    44-6556-41

    CONN IC DIP SOCKET 44POS GOLD

    Aries Electronics

    2,207
    RFQ
    44-6556-41

    Datasheet

    44-6556-41 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    546-83-545-17-000147

    546-83-545-17-000147

    CONN SOCKET PGA 545POS GOLD

    Preci-Dip

    2,066
    RFQ
    546-83-545-17-000147

    Datasheet

    546-83-545-17-000147 546 Bulk Active PGA 545 (17 x 17) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    80-PRS13127-12

    80-PRS13127-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,710
    RFQ
    80-PRS13127-12

    Datasheet

    80-PRS13127-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    Total 19086 Record«Prev1... 890891892893894895896897...955Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER