Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-87-306-41-018101

    116-87-306-41-018101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    4,501
    RFQ
    116-87-306-41-018101

    Datasheet

    116-87-306-41-018101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-306-41-005101

    110-83-306-41-005101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    2,694
    RFQ
    110-83-306-41-005101

    Datasheet

    110-83-306-41-005101 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    02-0513-10H

    02-0513-10H

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    3,963
    RFQ
    02-0513-10H

    Datasheet

    02-0513-10H 0513 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    04-0518-10

    04-0518-10

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    3,737
    RFQ
    04-0518-10

    Datasheet

    04-0518-10 518 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    04-1518-10

    04-1518-10

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    4,793
    RFQ
    04-1518-10

    Datasheet

    04-1518-10 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-304-41-018101

    116-83-304-41-018101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,756
    RFQ
    116-83-304-41-018101

    Datasheet

    116-83-304-41-018101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-304-41-009101

    116-87-304-41-009101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    4,402
    RFQ
    116-87-304-41-009101

    Datasheet

    116-87-304-41-009101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-610-41-005101

    110-87-610-41-005101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    2,742
    RFQ
    110-87-610-41-005101

    Datasheet

    110-87-610-41-005101 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 28-HZL/7-TT

    AR 28-HZL/7-TT

    CONN IC DIP SOCKET 28POS TIN

    Assmann WSW Components

    4,502
    RFQ
    AR 28-HZL/7-TT

    Datasheet

    AR 28-HZL/7-TT - Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR18-HZL-TT

    AR18-HZL-TT

    CONN IC DIP SOCKET 18POS TIN

    Assmann WSW Components

    3,286
    RFQ
    AR18-HZL-TT

    Datasheet

    AR18-HZL-TT - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    115-83-306-41-001101

    115-83-306-41-001101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    3,923
    RFQ

    -

    115-83-306-41-001101 115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A24-LCG

    A24-LCG

    CONN IC DIP SOCKET 24POS GOLD

    Assmann WSW Components

    4,759
    RFQ

    -

    A24-LCG - - Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - - Through Hole Open Frame - 0.100" (2.54mm) Gold - - - -
    DIP314-001B

    DIP314-001B

    DIP SOCKET 14 CTS

    Amphenol ICC (FCI)

    4,025
    RFQ
    DIP314-001B

    Datasheet

    DIP314-001B - Bag Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    AW 127-23/Z-T

    AW 127-23/Z-T

    SOCKET 23 CONTACTS SINGLE ROW

    Assmann WSW Components

    3,850
    RFQ
    AW 127-23/Z-T

    Datasheet

    AW 127-23/Z-T - - Active - - - - - - - - - - - - - - -
    03-0518-11

    03-0518-11

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    2,174
    RFQ
    03-0518-11

    Datasheet

    03-0518-11 518 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-87-306-31-012101

    614-87-306-31-012101

    CONN IC DIP SOCKET 325POS GOLD

    Preci-Dip

    3,318
    RFQ
    614-87-306-31-012101

    Datasheet

    614-87-306-31-012101 614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 325 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-304-41-003101

    116-83-304-41-003101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    2,068
    RFQ
    116-83-304-41-003101

    Datasheet

    116-83-304-41-003101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    WMS-180Z

    WMS-180Z

    CONN IC DIP SOCKET 18POS GOLD

    On Shore Technology Inc.

    4,382
    RFQ
    WMS-180Z

    Datasheet

    WMS-180Z WMS Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass - -40°C ~ 105°C
    A18-LCG-T-R

    A18-LCG-T-R

    CONN IC DIP SOCKET 18POS GOLD

    Assmann WSW Components

    4,712
    RFQ
    A18-LCG-T-R

    Datasheet

    A18-LCG-T-R - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    241-14-1-03

    241-14-1-03

    CONN IC DIP SOCKET 14POS TIN

    CNC Tech

    2,412
    RFQ
    241-14-1-03

    Datasheet

    241-14-1-03 - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
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