Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
642-60AB HEATSINK FOR 35MM BGA Wakefield-Vette	3,703	-	RFQ	Datasheet	642	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.600" (15.24mm)	-	6.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
529902B02100G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	3,896	-	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	2.000" (50.80mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	6.0W @ 30°C	1.50°C/W @ 500 LFM	4.50°C/W	Aluminum	Black Anodized
HSE-B20635-035H-W HEAT SINK, EXTRUSION, TO-220, 63 Same Sky (Formerly CUI Devices)	3,371	-	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Angled Fins	2.500" (63.50mm)	1.378" (35.00mm)	-	0.500" (12.70mm)	9.2W @ 75°C	4.35°C/W @ 200 LFM	8.15°C/W	Aluminum Alloy	Black Anodized
533722B02552G HEAT SINK Boyd Laconia, LLC	3,166	-	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220 (Dual)	Clip and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	12.0W @ 70°C	4.00°C/W @ 200 LFM	5.70°C/W	Aluminum	Black Anodized
HSE-B630-04H HEAT SINK, EXTRUSION, TO-220, 63 Same Sky (Formerly CUI Devices)	3,718	-	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	2.480" (63.00mm)	1.378" (35.00mm)	-	1.000" (25.40mm)	14.4W @ 75°C	2.31°C/W @ 200 LFM	9.37°C/W	Aluminum Alloy	Black Anodized
ATS-PCBM1103 BOARD LEVEL HEAT SINK Advanced Thermal Solutions Inc.	4,092	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	-	1.50°C/W @ 200 LFM	4.70°C/W	Aluminum	Black Anodized
HSE-B18508-035H-03 HEAT SINK, EXTRUSION, TO-218, 50 Same Sky (Formerly CUI Devices)	4,306	-	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-218	Clip and PC Pin	Rectangular, Angled Fins	2.000" (50.80mm)	1.638" (41.60mm)	-	0.984" (25.00mm)	13.0W @ 75°C	3.44°C/W @ 200 LFM	5.77°C/W	Aluminum Alloy	Black Anodized
624-25ABT5 HEATSINK FOR 21MM BGA Wakefield-Vette	4,254	-	RFQ	Datasheet	624	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.250" (6.35mm)	-	25.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
634-20AB HEATSINK TO-220 VERT MT BLK 2.0" Wakefield-Vette	3,354	-	RFQ	Datasheet	634	Bulk	Active	Board Level, Vertical	TO-220, TO-218	Bolt On	Rectangular, Fins	2.000" (50.80mm)	0.640" (16.26mm)	-	0.640" (16.26mm)	-	-	-	Aluminum	Black Anodized
TGH-0160-01 ALUMINIUM HEAT SINK 16X16MM t-Global Technology	14	-	RFQ	Datasheet	TGH	Bulk	Obsolete	Top Mount	-	-	Square, Fins	0.630" (16.00mm)	0.630" (16.00mm)	-	0.433" (11.00mm)	-	-	-	Aluminum	Clean Anodized
624-45AB-T4E HEATSINK CPU 21MM SQ Wakefield-Vette	2,007	-	RFQ	Datasheet	624	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.450" (11.43mm)	-	15.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
ATS-PCBM1100 BOARD LEVEL HEAT SINK Advanced Thermal Solutions Inc.	3,972	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.500" (38.10mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	-	3.10°C/W @ 200 LFM	3.90°C/W	Aluminum	Black Anodized
642-35ABT1E HEATSINK FOR 35MM BGA Wakefield-Vette	2,842	-	RFQ	Datasheet	642	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.350" (8.89mm)	-	8.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
642-35ABT4E HEATSINK FOR 35MM BGA Wakefield-Vette	3,290	-	RFQ	Datasheet	642	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.350" (8.89mm)	-	8.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
594302B02853G HEATSINK TO-220 W/KOOL CLIP BLK Boyd Laconia, LLC	2,923	-	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220	Clip and Board Locks	Rectangular, Fins	2.000" (50.80mm)	1.380" (35.05mm)	-	0.480" (12.19mm)	6.0W @ 60°C	3.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
V2200N1-F-LP HEATSINK CPU W/ADHESIVE STAMPED Assmann WSW Components	2,748	-	RFQ	Datasheet	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Fins	1.181" (30.00mm)	1.181" (30.00mm)	-	0.512" (13.00mm)	-	-	-	Aluminum Alloy	Natural Anodized
6038DG BOARD LEVEL HEAT SINK Boyd Laconia, LLC	2,968	-	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220	Clip and PC Pin	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	2.0W @ 40°C	8.00°C/W @ 500 LFM	18.00°C/W	Aluminum	Tin
V2201N1-LP HEATSINK CPU STAMPED Assmann WSW Components	4,597	-	RFQ	Datasheet	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Fins	1.457" (37.00mm)	1.457" (37.00mm)	-	0.551" (14.00mm)	-	-	-	Aluminum Alloy	Natural Anodized
HSE-B18635-035H HEAT SINK, EXTRUSION,TO-218, 63. Same Sky (Formerly CUI Devices)	3,081	-	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-218	Bolt On and PC Pin	Rectangular, Angled Fins	2.500" (63.50mm)	1.638" (41.60mm)	-	0.984" (25.00mm)	16.7W @ 75°C	2.24°C/W @ 200 LFM	4.49°C/W	Aluminum Alloy	Black Anodized
HSE-B18635-035H-04 HEAT SINK, EXTRUSION, TO-218, 63 Same Sky (Formerly CUI Devices)	2,616	-	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-218	Clip and PC Pin	Rectangular, Angled Fins	2.500" (63.50mm)	1.638" (41.60mm)	-	0.984" (25.00mm)	15.1W @ 75°C	2.38°C/W @ 200 LFM	4.97°C/W	Aluminum Alloy	Black Anodized

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