Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
530714B05300G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	2,250	-	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.710" (18.03mm)	0.955" (24.26mm)	-	0.500" (12.70mm)	2.0W @ 40°C	4.00°C/W @ 700 LFM	20.30°C/W	Aluminum	Black Anodized
TGH-0380-01 ALUMINIUM HEAT SINK 38X20MM t-Global Technology	4,244	-	RFQ	Datasheet	TGH	Bulk	Active	Top Mount	-	-	Rectangular, Fins	0.787" (20.00mm)	1.496" (38.00mm)	-	0.354" (9.00mm)	-	-	-	Aluminum	Clean Anodized
KU-SMK-0498-ES-ST-0,8MM-1-SG KU-SMK-0498-ES-ST-0,8MM-1-SG Boyd Laconia, LLC	3,472	-	RFQ	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-
ATS-PCBM1104 BOARD LEVEL HEAT SINK Advanced Thermal Solutions Inc.	2,628	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.500" (38.10mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	-	1.40°C/W @ 200 LFM	3.80°C/W	Aluminum	Black Anodized
6273B BOARD LEVEL HEAT SINK Boyd Laconia, LLC	3,722	-	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-202	Bolt On	Rectangular, Fins	0.750" (19.05mm)	0.750" (19.05mm)	-	0.375" (9.52mm)	1.5W @ 40°C	10.00°C/W @ 200 LFM	21.00°C/W	Aluminum	Black Anodized
311505A00000G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	2,728	-	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-5	Press Fit	Cylindrical	-	-	0.317" (8.05mm) ID, 0.375" (9.52mm) OD	0.400" (10.16mm)	1.0W @ 70°C	45.00°C/W @ 200 LFM	90.00°C/W	Aluminum	Hard Anodized
658-25ABT6 HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	3,475	-	RFQ	Datasheet	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.250" (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
HSE-B635-045H HEAT SINK, EXTRUSION, TO-220, 63 Same Sky (Formerly CUI Devices)	4,188	-	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Angled Fins	2.500" (63.50mm)	1.772" (45.00mm)	-	0.500" (12.70mm)	11.7W @ 75°C	3.53°C/W @ 200 LFM	6.41°C/W	Aluminum Alloy	Black Anodized
HSE-B18635-060H-W HEAT SINK, EXTRUSION, TO-218, 63 Same Sky (Formerly CUI Devices)	2,516	-	RFQ	Datasheet	HSE	Box	Active	Board Level, Vertical	TO-218	Bolt On and PC Pin	Rectangular, Angled Fins	2.500" (63.50mm)	1.638" (41.60mm)	-	0.984" (25.00mm)	16.7W @ 75°C	2.24°C/W @ 200 LFM	4.49°C/W	Aluminum Alloy	Black Anodized
658-35ABT1E HEATSINK CPU 28MM SQBLK W/O TAPE Wakefield-Vette	4,014	-	RFQ	Datasheet	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.250" (6.35mm)	-	3.00°C/W @ 800 LFM	-	Aluminum	Black Anodized
574602B00000G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	4,524	-	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220	Clip	Rectangular, Fins	0.690" (17.53mm)	0.860" (21.84mm)	-	0.395" (10.03mm)	3.0W @ 60°C	6.00°C/W @ 600 LFM	21.60°C/W	Aluminum	Black Anodized
625-35ABT1E HEATSINK FOR 25MM BGA Wakefield-Vette	2,580	-	RFQ	Datasheet	625	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.350" (8.89mm)	-	1.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
624-60ABT1E HEATSINK FOR 21MM BGA Wakefield-Vette	3,324	-	RFQ	Datasheet	624	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.600" (15.24mm)	-	1.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
624-60ABT3 HEATSINK FOR 21MM BGA Wakefield-Vette	3,882	-	RFQ	Datasheet	624	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.600" (15.24mm)	-	1.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
624-60ABT4E HEATSINK FOR 21MM BGA Wakefield-Vette	4,436	-	RFQ	Datasheet	624	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.600" (15.24mm)	-	1.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
286-CTE HEATSINK FOR TO220 Wakefield-Vette	2,537	-	RFQ	Datasheet	286	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.190" (30.23mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	4.0W @ 58°C	7.40°C/W @ 200 LFM	-	Copper	Tin
625-25ABT5 HEATSINK FOR 25MM BGA Wakefield-Vette	3,372	-	RFQ	Datasheet	625	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.250" (6.35mm)	-	12.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
625-60ABT1E HEATSINK FOR 25MM BGA Wakefield-Vette	4,253	-	RFQ	Datasheet	625	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.600" (15.24mm)	-	8.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
642-25ABT3 HEATSINK FOR 35MM BGA Wakefield-Vette	3,147	-	RFQ	Datasheet	642	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.250" (6.35mm)	-	1.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
630-60ABT3 HEATSINK FOR 35MM BGA Wakefield-Vette	3,977	-	RFQ	Datasheet	630	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.600" (15.24mm)	-	3.00°C/W @ 350 LFM	-	Aluminum	Black Anodized

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