Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    AR 28-HZL/01-7-TT

    AR 28-HZL/01-7-TT

    SOCKET

    Assmann WSW Components

    3,204
    RFQ

    -

    AR 28-HZL/01-7-TT AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    A-ICS-254-20-TT50

    A-ICS-254-20-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    2,580
    RFQ
    A-ICS-254-20-TT50

    Datasheet

    A-ICS-254-20-TT50 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR 42-HZL/07-TT

    AR 42-HZL/07-TT

    SOCKET

    Assmann WSW Components

    2,268
    RFQ

    -

    AR 42-HZL/07-TT AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR 24-HZW/TN

    AR 24-HZW/TN

    CONN IC DIP SOCKET 24POS GOLD

    Assmann WSW Components

    2,485
    RFQ
    AR 24-HZW/TN

    Datasheet

    AR 24-HZW/TN - Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    AR 48-HZL/07-TT

    AR 48-HZL/07-TT

    CONN IC DIP SOCKET 48POS GOLD

    Assmann WSW Components

    3,683
    RFQ
    AR 48-HZL/07-TT

    Datasheet

    AR 48-HZL/07-TT - Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    A-ICS-254-24-TT50

    A-ICS-254-24-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    2,434
    RFQ
    A-ICS-254-24-TT50

    Datasheet

    A-ICS-254-24-TT50 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR 50-HZL/07-TT

    AR 50-HZL/07-TT

    SOCKET

    Assmann WSW Components

    2,756
    RFQ

    -

    AR 50-HZL/07-TT AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR 52-HZL/07-TT

    AR 52-HZL/07-TT

    SOCKET

    Assmann WSW Components

    2,761
    RFQ

    -

    AR 52-HZL/07-TT AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    A-ICS-254-28-TT50

    A-ICS-254-28-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    4,656
    RFQ
    A-ICS-254-28-TT50

    Datasheet

    A-ICS-254-28-TT50 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR32-HZW/T-R

    AR32-HZW/T-R

    CONN IC DIP SOCKET 32POS TIN

    Assmann WSW Components

    3,151
    RFQ
    AR32-HZW/T-R

    Datasheet

    AR32-HZW/T-R - Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    Total 326 Record«Prev1... 282930313233Next»
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