Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
502403B00000 HEAT SINK 12W 1.25"H SPACE SAVER Boyd Laconia, LLC	2,816	-	RFQ	Datasheet	-	Bag	Not For New Designs	Board Level	-	Bolt On	Rhombus	1.630" (41.40mm)	1.290" (32.77mm)	-	1.250" (31.75mm)	-	-	-	Aluminum	Black Anodized
634-15AB HEATSINK SLIM VERT BLACK TO-220 Wakefield-Vette	3,902	-	RFQ	Datasheet	634	Bulk	Active	Board Level, Vertical	TO-220, TO-218	Bolt On	Rectangular, Fins	1.500" (38.10mm)	0.640" (16.26mm)	-	0.640" (16.26mm)	3.0W @ 50°C	2.00°C/W @ 300 LFM	50.00°C/W	Aluminum	Black Anodized
KU-SMK-0498-ES-ST-0,8MM-3-L KU-SMK-0498-ES-ST-0,8MM-3-L Boyd Laconia, LLC	3,065	-	RFQ	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-
HSS-C2540-SMT-TR HEAT SINK TO-263 COPPER Same Sky (Formerly CUI Devices)	4,616	-	RFQ	Datasheet	HSS	Tape & Reel (TR)	Active	Board Level	TO-263 (D²Pak)	-	Rectangular, Fins	0.763" (19.38mm)	1.000" (25.40mm)	-	0.450" (11.43mm)	3.8W @ 75°C	5.50°C/W @ 200 LFM	21.90°C/W	Copper	Tin
627-25ABPE HEATSINK FOR TO218/TO220 Wakefield-Vette	2,889	-	RFQ	Datasheet	627	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	0.500" (12.70mm)	1.375" (34.93mm)	-	2.500" (63.50mm)	6.0W @ 48°C	4.20°C/W @ 200 LFM	-	Aluminum	Black Anodized
630-25ABT5 HEATSINK FOR 35MM BGA Wakefield-Vette	4,594	-	RFQ	Datasheet	630	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.250" (6.35mm)	-	7.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
BDN10-5CB/A01 HEATSINK CPU W/ADHESIVE 1.01"SQ CTS Thermal Management Products	3,304	-	RFQ	Datasheet	BDN	Tray	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.010" (25.65mm)	1.010" (25.65mm)	-	0.555" (14.10mm)	-	6.30°C/W @ 400 LFM	20.80°C/W	Aluminum	Black Anodized
10-6327-02G 10-6327-02G Boyd Laconia, LLC	3,738	-	RFQ	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-
V9772Y1-LP PROFILE HEATSINK Assmann WSW Components	3,779	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.969" (50.00mm)	2.559" (65.00mm)	-	0.709" (18.00mm)	-	-	4.90°C/W	Aluminum Alloy	Black Anodized
VRV-27-101E HEATSINK 27MM DEGREASED Ohmite	2,682	-	RFQ	Datasheet	VR	Box	Obsolete	Board Level, Vertical	TO-220, TO-247	Clip and PC Pin	Rectangular, Fins	1.063" (27.00mm)	1.335" (33.90mm)	-	1.555" (39.50mm)	-	-	-	Aluminum	Degreased
630-35ABT4E HEATSINK FOR 35MM BGA Wakefield-Vette	3,069	-	RFQ	Datasheet	630	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.350" (8.89mm)	-	5.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
628-35ABT1E HEATSINK FOR 45MM BGA Wakefield-Vette	2,301	-	RFQ	Datasheet	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	0.350" (8.89mm)	3.0W @ 50°C	10.00°C/W @ 150 LFM	-	Aluminum	Black Anodized
642-25ABT5 HEATSINK FOR 35MM BGA Wakefield-Vette	3,297	-	RFQ	Datasheet	642	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.250" (6.35mm)	-	1.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
V2037A CPU HEATSINKS Assmann WSW Components	4,583	-	RFQ	-	-	Bulk	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.230" (31.25mm)	1.230" (31.25mm)	-	0.559" (14.20mm)	-	-	5.00°C/W	Aluminum Alloy	Clean Finished
V2036A CPU HEATSINKS Assmann WSW Components	2,025	-	RFQ	-	-	Bulk	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.230" (31.25mm)	1.230" (31.25mm)	-	0.394" (10.00mm)	-	-	6.00°C/W	Aluminum Alloy	Clean Finished
625-45ABT1E HEATSINK FOR 25MM BGA Wakefield-Vette	3,371	-	RFQ	Datasheet	625	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.450" (11.43mm)	-	8.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
SW38-4G HTSK-AL-000SW-38-BG (SW38-4G ZA3 Boyd Laconia, LLC	2,784	-	RFQ	-	-	Bulk	Active	Board Level, Extrusion	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.496" (38.00mm)	1.359" (34.50mm)	-	0.492" (12.50mm)	4.0W @ 50°C	6.00°C/W @ 200 LFM	10.20°C/W	Aluminum	Black Anodized
630-35ABT3 HEATSINK FOR 35MM BGA Wakefield-Vette	4,804	-	RFQ	Datasheet	630	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.350" (8.89mm)	-	5.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
626-25ABPE HEATSINK FOR TO218/TO220 Wakefield-Vette	4,670	-	RFQ	Datasheet	626	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	0.500" (12.70mm)	1.375" (34.93mm)	-	2.500" (63.50mm)	6.0W @ 48°C	4.20°C/W @ 200 LFM	-	Aluminum	Black Anodized
662-15AB HEATSINK EXTRUSION 45MM Wakefield-Vette	3,938	-	RFQ	Datasheet	662	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.713" (43.51mm)	1.713" (43.51mm)	-	0.150" (3.81mm)	2.0W @ 30°C	8.00°C/W @ 200 LFM	-	Aluminum	Black Anodized

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