Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
574602B03300G HEATSINK TO-220 CLIP-ON/TAB Boyd Laconia, LLC	4,542	-	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220	Clip and PC Pin	Rectangular, Fins	0.690" (17.53mm)	0.860" (21.84mm)	-	0.395" (10.03mm)	3.0W @ 60°C	6.00°C/W @ 600 LFM	21.60°C/W	Aluminum	Black Anodized
V10196E1 CPU HEATSINK, CROSS CUT, AL6063, Assmann WSW Components	3,294	-	RFQ	Datasheet	-	Bag	Active	Top Mount	CPU	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.654" (42.00mm)	1.654" (42.00mm)	-	0.992" (25.20mm)	-	-	12.00°C/W	Aluminum	Black Anodized
10-L4LB-11G HEATSINK BGA W/PUSH PINS Boyd Laconia, LLC	3,843	-	RFQ	Datasheet	-	Bulk	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	1.630" (41.40mm)	1.780" (45.21mm)	-	0.461" (11.70mm)	4.0W @ 60°C	4.90°C/W @ 200 LFM	14.20°C/W	Aluminum	Black Anodized
642-60ABT1E HEATSINK FOR 35MM BGA Wakefield-Vette	4,331	-	RFQ	Datasheet	642	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.600" (15.24mm)	-	6.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
628-40ABT4E HEATSINK FOR 45MM BGA Wakefield-Vette	2,127	-	RFQ	Datasheet	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	4.000" (101.60mm)	2.5W @ 30°C	4.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
EH-210-H125-T411,FG,(GP) EH-210-H125-T411,FG,(GP) Boyd Laconia, LLC	4,638	-	RFQ	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-
VRV-55-101E HEATSINK 55MM DEGREASED Ohmite	2,815	-	RFQ	Datasheet	VR	Box	Obsolete	Board Level, Vertical	TO-220, TO-247	Clip and PC Pin	Rectangular, Fins	2.165" (55.00mm)	1.335" (33.90mm)	-	1.555" (39.50mm)	-	-	-	Aluminum	Degreased
6399B- P2G 6399B- P2G Boyd Laconia, LLC	4,158	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	1.650" (41.91mm)	1.000" (25.40mm)	-	2.000" (50.80mm)	6.0W @ 30°C	2.00°C/W @ 300 LFM	3.30°C/W	Aluminum	Black Anodized
500103B00000G HEATSINK TO-3 10W H=.50" BLK Boyd Laconia, LLC	4,345	-	RFQ	Datasheet	-	Bag	Not For New Designs	Board Level	TO-3	Bolt On	Square, Pin Fins	1.810" (45.97mm)	1.810" (45.97mm)	-	0.500" (12.70mm)	6.0W @ 50°C	2.50°C/W @ 400 LFM	7.20°C/W	Aluminum	Black Anodized
508700B00000G HEATSINK 40-PIN DIP GLUE-ON BLK Boyd Laconia, LLC	4,251	-	RFQ	Datasheet	-	Bag	Active	Top Mount	40-DIP	Thermal Tape, Adhesive (Not Included)	Rectangular, Fins	2.000" (50.80mm)	0.530" (13.46mm)	-	0.190" (4.83mm)	1.0W @ 30°C	16.00°C/W @ 300 LFM	27.20°C/W	Aluminum	Black Anodized
HSB22-606010 HEAT SINK, BGA, 60 X 60 X 10 MM Same Sky (Formerly CUI Devices)	3,219	-	RFQ	Datasheet	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	2.362" (60.00mm)	2.362" (60.00mm)	-	0.394" (10.00mm)	9.8W @ 75°C	2.60°C/W @ 200 LFM	7.62°C/W	Aluminum	Black Anodized
7148DG BOARD LEVEL HEAT SINK Boyd Laconia, LLC	4,344	-	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	Multiwatt, SIP	Clip and PC Pin	Rectangular, Fins	0.795" (20.19mm)	0.915" (23.24mm)	-	0.380" (9.65mm)	1.0W @ 30°C	6.00°C/W @ 600 LFM	16.00°C/W	Copper	Tin
110070016 RPI HEAT SINK KIT COPPER/ALUM Seeed Technology Co., Ltd	4,064	-	RFQ	Datasheet	-	Bulk	Obsolete	Heat Spreader Kit, Top Mount	Raspberry Pi	-	Square	-	-	-	-	-	-	-	Aluminum, Copper	-
628-65ABT4E HEATSINK FOR 45MM BGA Wakefield-Vette	2,287	-	RFQ	Datasheet	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	0.650" (16.51mm)	3.0W @ 20°C	2.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
642-60ABT5 HEATSINK FOR 35MM BGA Wakefield-Vette	3,239	-	RFQ	Datasheet	642	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.600" (15.24mm)	-	6.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
579003B00000G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	4,338	-	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-3	Bolt On	Rhombus	1.830" (46.48mm)	1.830" (46.48mm)	-	1.000" (25.40mm)	4.0W @ 30°C	3.50°C/W @ 200 LFM	6.00°C/W	Aluminum	Black Anodized
547-24AB HEATSINK DC/DC QUARTER BRICK Wakefield-Vette	3,972	-	RFQ	Datasheet	547	Bulk	Active	Board Level, Vertical	Quarter Brick DC/DC Converter	Bolt On, Thermal Material	Rectangular, Fins	1.450" (36.83mm)	2.280" (57.91mm)	-	0.240" (6.10mm)	-	3.50°C/W @ 300 LFM	-	Aluminum	Black Anodized
7020B-TC12-MTG 7020B-TC12-MTG Boyd Laconia, LLC	4,847	-	RFQ	-	-	Bulk	Active	Board Level	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.255" (31.88mm)	0.470" (11.94mm)	-	1.450" (36.83mm)	4.0W @ 40°C	4.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
628-40ABT5 HEATSINK FOR 45MM BGA Wakefield-Vette	4,319	-	RFQ	Datasheet	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	4.000" (101.60mm)	2.5W @ 30°C	4.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
MBH33051-23W/2.6 AL HEAT SINK 33X33X23MM Malico Inc.	2,054	-	RFQ	-	-		Active	-	-	-	-	-	-	-	-	-	-	-	-	-

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