Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
628-35ABT4E HEATSINK FOR 45MM BGA Wakefield-Vette	3,401	-	RFQ	Datasheet	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	0.350" (8.89mm)	3.0W @ 50°C	10.00°C/W @ 150 LFM	-	Aluminum	Black Anodized
PRT-11510 SMALL HEATSINK SparkFun Electronics	2,506	-	RFQ	-	-	Bulk	Discontinued at Digi-Key	Top Mount	Allegro A4983	-	Rectangular, Fins	0.250" (6.35mm)	0.190" (4.83mm)	-	0.300" (7.62mm)	-	-	-	-	Black Anodized
V6560F PROFILE HEATSINK Assmann WSW Components	3,326	-	RFQ	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-
E2A-T220-25E BLACK ANODIZED HEATSINK Ohmite	4,111	-	RFQ	Datasheet	EX	Box	Active	Board Level, Vertical	TO-220	Bolt On and Board Mounts	Rectangular, Fins	0.641" (16.28mm)	0.642" (16.30mm)	-	1.000" (25.40mm)	2.0W @ 40°C	4.00°C/W @ 500 LFM	16.40°C/W	Aluminum	Black Anodized
628-65ABT1E HEATSINK FOR 45MM BGA Wakefield-Vette	2,580	-	RFQ	Datasheet	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	0.650" (16.51mm)	3.0W @ 20°C	2.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
10-6327-01G HEATSINK BGA W/PUSH PINS Boyd Laconia, LLC	4,565	-	RFQ	-	-	Bulk	Active	Top Mount	BGA	Push Pin	Square	1.122" (28.50mm)	1.122" (28.50mm)	-	0.394" (10.00mm)	2.0W @ 60°C	9.30°C/W @ 200 LFM	30.60°C/W	Aluminum	Black Anodized
ATS-PCBM1106 BOARD LEVEL HEAT SINK Advanced Thermal Solutions Inc.	4,088	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	2.500" (63.50mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	-	1.00°C/W @ 200 LFM	3°C/W	Aluminum	Black Anodized
374624B00000G BGA HEAT SINK Boyd Laconia, LLC	4,745	-	RFQ	-	-	Bulk	Active	-	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	-	-	-	-	0.394" (10.00mm)	2.0W @ 50°C	6.00°C/W @ 300 LFM	23.40°C/W	Aluminum	Black Anodized
241802B92200G 241802B92200G Boyd Laconia, LLC	3,459	-	RFQ	-	-	Bulk	Active	Top Mount	Eighth Brick DC/DC Converter	Bolt On	Rectangular, Fins	2.280" (57.90mm)	0.902" (22.90mm)	-	0.240" (6.10mm)	-	3.00°C/W @ 600 LFM	5.60°C/W	-	-
241802B91200G 241802B91200G Boyd Laconia, LLC	4,062	-	RFQ	-	-	Bulk	Active	Top Mount	Eighth Brick DC/DC Converter	Bolt On	Rectangular, Fins	2.280" (57.90mm)	0.902" (22.90mm)	-	0.240" (6.10mm)	-	5.00°C/W @ 600 LFM	9.00°C/W	-	-
576403B00000G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	4,934	-	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-3	Bolt On	Square, Pin Fins	1.810" (45.97mm)	1.810" (45.97mm)	-	1.250" (31.75mm)	10.0W @ 50°C	1.50°C/W @ 600 LFM	5.10°C/W	Aluminum	Black Anodized
MBH15001-20L/1.7 AL HEAT SINK 15X15X20MM Malico Inc.	8	-	RFQ	Datasheet	MBH	Tray	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Fins	0.591" (15.01mm)	0.591" (15.00mm)	-	0.776" (19.70mm)	-	-	-	Aluminum Alloy	Black Anodized
HBH22031-13 AL HEAT SINK 22X22X13MM Malico Inc.	4,482	-	RFQ	-	-		Active	-	-	-	-	-	-	-	-	-	-	-	-	-
WV-T264-101E HEATSINK W/CLIP FOR TO-264 Ohmite	2,612	-	RFQ	Datasheet	W	Box	Obsolete	Board Level, Vertical	TO-264	Clip and PC Pin	Rectangular, Fins	1.260" (32.00mm)	0.921" (23.40mm)	-	0.630" (16.00mm)	1.0W @ 20°C	8.00°C/W @ 500 LFM	12.00°C/W	Aluminum	Unfinished
628-35ABT5 HEATSINK FOR 45MM BGA Wakefield-Vette	3,609	-	RFQ	Datasheet	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	0.350" (8.89mm)	3.0W @ 50°C	10.00°C/W @ 150 LFM	-	Aluminum	Black Anodized
593002B03400GW/LEAD IN @ 593002B03400GW/LEAD IN @ .925 Boyd Laconia, LLC	2,211	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.942" (23.92mm)	0.500" (12.70mm)	-	1.180" (29.97mm)	1.0W @ 20°C	4.00°C/W @ 500 LFM	13.40°C/W	Aluminum	Black Anodized
642-60ABT4E HEATSINK FOR 35MM BGA Wakefield-Vette	4,225	-	RFQ	Datasheet	642	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.600" (15.24mm)	-	6.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
698-65AB HEATSINK EXTRUSION 45MM Wakefield-Vette	3,497	-	RFQ	Datasheet	698	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	2.100" (53.34mm)	2.100" (53.34mm)	-	0.650" (16.51mm)	-	2.50°C/W @ 300 LFM	-	Aluminum	Black Anodized
CS9462510BM 25X25X10MM, T412 Cooling Source	1	-	RFQ	-	CS94	Box	Active	Top Mount	-	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.394" (10.00mm)	-	5.71°C/W @ 200 LFM	-	Aluminum	Black Anodized
7178DG BOARD LEVEL HEAT SINK Boyd Laconia, LLC	2,807	-	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.375" (9.52mm)	0.6W @ 30°C	5.00°C/W @ 700 LFM	35.70°C/W	Copper	Tin

Total 122183 Record«Prev 1... 2222 2223 2224 222522262227 2228 2229...6110 Next»

HOME

PRODUCT

PHONE

USER

[email protected]