Heat Sinks

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
530101B00100G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	4,308	-	RFQ	Datasheet	-	Bulk	Active	Board Level, Vertical	TO-218, TO-247	Bolt On and Board Mounts	Square, Fins	1.750" (44.45mm)	0.490" (12.44mm)	-	1.750" (44.45mm)	4.0W @ 30°C	1.50°C/W @ 400 LFM	6.30°C/W	Aluminum	Black Anodized
6299BG 6299BG Boyd Laconia, LLC	4,383	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-218, TO-220	Bolt On and PC Pin	Rectangular, Fins	1.638" (41.60mm)	0.992" (25.20mm)	-	2.000" (50.80mm)	-	-	6.70°C/W	Aluminum	Black Anodized
7129DG BOARD LEVEL HEAT SINK Boyd Laconia, LLC	3,991	-	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-220	Clip	Rectangular, Fins	1.040" (26.42mm)	0.866" (22.00mm)	-	0.375" (9.52mm)	3.5W @ 70°C	7.00°C/W @ 500 LFM	19.20°C/W	Copper	Tin
374424B60023G 374424B60023G Boyd Laconia, LLC	4,804	-	RFQ	-	-	Bulk	Active	Top Mount	BGA, FPGA	Solder Anchor	Square, Pin Fins	1.063" (27.00mm)	1.063" (27.00mm)	-	0.709" (18.00mm)	3.0W @ 50°C	6.50°C/W @ 200 LFM	20.30°C/W	Aluminum	Black Anodized
580200W00000G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	4,050	-	RFQ	Datasheet	-	Bulk	Active	Top Mount	14-DIP and 16-DIP	Press Fit and PC Pin	Rectangular, Fins	0.890" (22.61mm)	0.600" (15.24mm)	-	0.410" (10.42mm)	1.0W @ 20°C	12.00°C/W @ 200 LFM	20.00°C/W	Aluminum	Black Anodized
FIT0818 BLACK ALUMINUM HEATSINKKIT FOR R DFRobot	3,836	-	RFQ	-	-	Bulk	Active	Top Mount	Raspberry Pi 4B	Thermal Tape, Adhesive (Included)	Rectangular, Pin Fins	-	-	-	-	-	-	-	Aluminum	-
628-25ABT1E HEATSINK FOR 45MM BGA Wakefield-Vette	2,033	-	RFQ	Datasheet	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	0.250" (6.35mm)	4.5W @ 80°C	7.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
E3A-T220-25E BLACK ANODIZED HEATSINK Ohmite	2,653	-	RFQ	Datasheet	EX	Bulk	Active	Board Level	Bridge Rectifiers	Bolt On	Square, Fins	1.000" (25.40mm)	1.000" (25.40mm)	-	1.000" (25.40mm)	-	-	12.40°C/W	Aluminum	Black Anodized
628-65ABT5 HEATSINK CPU 43MM SQ BLK H=.65" Wakefield-Vette	2,168	-	RFQ	Datasheet	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	0.650" (16.51mm)	3.0W @ 20°C	2.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
SW25-2G THM,ZA3286 REV 6 SW25-2G Boyd Laconia, LLC	3,879	-	RFQ	-	-	Bulk	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	0.984" (25.00mm)	1.359" (34.50mm)	-	0.492" (12.50mm)	2.0W @ 30°C	6.00°C/W @ 400 LFM	13.00°C/W	Aluminum	Black Anodized
KU-0334-AL-ST-1,2MM-2-A-VE/VZ- KU-0334-AL-ST-1,2MM-2-A-VE/VZ- Boyd Laconia, LLC	4,892	-	RFQ	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-
VXV-55-101E EXTRUDED HEATSINK 55MM SOT-227 Ohmite	4,826	-	RFQ	Datasheet	VX	Box	Obsolete	Board Level	SOT-227	Bolt On	Rectangular, Angled Fins	1.917" (48.70mm)	2.165" (55.00mm)	-	1.181" (30.00mm)	-	-	-	Aluminum	Degreased
1542500-1 HTS795-1=HS UPLTD TE Connectivity AMP Connectors	4,453	-	RFQ	-	-	Bag	Active	-	-	-	-	-	-	-	-	-	-	-	-	-
DV-T268-101E-TR TO-268 HEAT SINK /POLY TAPE Ohmite	2,787	-	RFQ	Datasheet	D	Tape & Reel (TR)	Active	Top Mount	TO-268 (D³Pak)	Solderable Feet	Rectangular, Fins	0.500" (12.70mm)	1.220" (30.99mm)	-	0.400" (10.16mm)	5.0W @ 35°C	6.00°C/W @ 600 LFM	-	Aluminum	Degreased
DV-T268-401E-TR TO-268 SMD HEAT SINK Ohmite	4,576	-	RFQ	Datasheet	D	Tape & Reel (TR)	Active	Top Mount	TO-268 (D³Pak)	Solderable Feet	Rectangular, Fins	0.500" (12.70mm)	1.220" (30.99mm)	-	0.460" (11.68mm)	9.0W @ 43°C	5°C/W @ 500 LFM	-	Aluminum	Degreased
DV-T263-401E-TR TO-263 SMD HEAT SINK Ohmite	3,521	-	RFQ	Datasheet	D	Tape & Reel (TR)	Active	Top Mount	TO-263 (D²Pak)	Solderable Feet	Rectangular, Fins	0.500" (12.70mm)	1.030" (26.16mm)	-	0.460" (11.68mm)	7.0W @ 45°C	7°C/W @ 500 LFM	-	Aluminum	Degreased
TV58G THM,ZA2102 ISS 4 TV-58G Boyd Laconia, LLC	4,876	-	RFQ	-	-	Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.887" (22.53mm)	0.749" (19.03mm)	-	0.433" (11.00mm)	1.5W @ 50°C	14.00°C/W @ 400 LFM	30.00°C/W	Aluminum	Black Anodized
241804B91200G 241804B91200G Boyd Laconia, LLC	2,819	-	RFQ	-	-	Bulk	Active	Top Mount	Eighth Brick DC/DC Converter	Bolt On	Rectangular, Fins	2.280" (57.90mm)	0.902" (22.90mm)	-	0.449" (11.40mm)	-	3.00°C/W @ 500 LFM	5.50°C/W	-	-
325705R00000G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	3,465	-	RFQ	Datasheet	-	Bulk	Active	Board Level	TO-5	Press Fit	Cylindrical	-	-	0.318" (8.07mm) ID, 0.500" (12.70mm) OD	0.250" (6.35mm)	1.0W @ 60°C	35.00°C/W @ 200 LFM	60.00°C/W	Aluminum	Red Anodized
10-5607-04G 10-5607-04G Boyd Laconia, LLC	3,868	-	RFQ	-	-	Bulk	Active	Board Level	BGA, FPGA	Push Pin, Thermal Material	Square, Fins	1.470" (37.34mm)	1.470" (37.34mm)	-	0.390" (9.91mm)	3.0W @ 70°C	7.00°C/W @ 200 LFM	22.10°C/W	Aluminum	Black Anodized

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